A fuse structure includes a substrate, a fuse conductive trace disposed closer to a first chip
surface than to a second chip surface facing away from the first chip surface, a metallization …

(57) ABSTRACT A semiconductor chip 100 includes a logic unit and an analog unit 153.
Furthermore, the semiconductor chip 100 includes a silicon substrate 101; a first insulating …

The present invention offers a method for forming an opening portion by a simple process
Without using a photomask or a resist. Further, the present invention proposes a method for …

5,313,043 5,373,627 5,480,097 5,501,938 5,567,336 5,587,822 5,683,601 5,708,252
5,712,206 5,935.462 5,958,268 6,048,588 6,149,988 6,159,832 6,177,151 6,261,856 …

US7973341B2 - Fuse of semiconductor device - Google Patents US7973341B2 - Fuse of
semiconductor device - Google Patents Fuse of semiconductor device Download PDF Info …

A semiconductor device includes an interlayer insulating layer disposed over a
semiconductor substrate, and including a plurality of wiring layers; a seal ring disposed in …

Methods of forming a microelectronic structure are described. Embodiments of those
methods include forming a metallic fuse structure by forming at least one via on a first …

US7592206B2 - Fuse region and method of fabricating the same - Google Patents
US7592206B2 - Fuse region and method of fabricating the same - Google Patents Fuse region …

According to one aspect of the invention, there is provided a resistor circuit comprising: first
to Mth (M is an integer equal to or larger than two) resistor circuit units that are provided in …

The present invention relates to a laser fuse structure for high power applications.
Specifically, the laser fuse structure of the present invention comprises first and second …