Underfill flow in flip-chip encapsulation process: a review
The scope of review of this paper focused on the precuring underfilling flow stage of
encapsulation process. A total of 80 related works has been reviewed and being classified …
encapsulation process. A total of 80 related works has been reviewed and being classified …
Prediction of the void formation in no-flow underfill process using machine learning-based algorithm
This paper investigated the variation variables on the void formation in the no-flow underfill
process. A total of 96 distinct no-flow underfill cases were numerically simulated to …
process. A total of 96 distinct no-flow underfill cases were numerically simulated to …
No-flow underfill: Effect of chip placement speed on the void formation using numerical method
No-flow underfill process can enhance the production lead time since the curing and reflow
of solder interconnect and underfill are achieved simultaneously. Additionally, no-flow …
of solder interconnect and underfill are achieved simultaneously. Additionally, no-flow …
Electrical and electronics
V Nassiet, B Hassoune-Rhabbour, O Tramis, JA Petit - Adhesive Bonding, 2021 - Elsevier
From microelectronics to power electronics, adhesive bonding technology is finding more
and more important, extended, and diversified applications in electronics packaging. So …
and more important, extended, and diversified applications in electronics packaging. So …
Effects of different air gaps of underfill encapsulant on multi-stack printed circuit board
MA bin Abas, MAF bin Muhamed Mukhtar - Microelectronics Reliability, 2024 - Elsevier
This paper studies the effect of different air gaps on multi-stack printed circuit board (PCB)
using finite volume method (FVM). Air gaps of 150 mm 2 and 450 mm 2 were introduced to …
using finite volume method (FVM). Air gaps of 150 mm 2 and 450 mm 2 were introduced to …
Finite element analysis of underfill effect on the CBGA package reliability under thermal cycling
G Li, J Feng, T Wang, Z Sa… - 2022 23rd International …, 2022 - ieeexplore.ieee.org
Thermal cycling is one of the main failure factors of electronic devices, especially for CBGA
packaging. The large difference in CTE between interconnect materials often results in …
packaging. The large difference in CTE between interconnect materials often results in …