We demonstrate and characterize a new bonding-in-liquid technique (BiLT) for the
encapsulation of liquids in MEMS devices. Liquid encapsulation enables innovative MEMS …

We have developed a novel all SU-8 packaging method for microelectromechanical system
(MEMS) devices. The process is low temperature and low cost and it allows for nonhermetic …

The hermeticity performance of the cavity structure has an impact on the long-term stability of
absolute pressure sensors for high temperature applications. In this paper, a bare silicon …

In this article, we propose a thermal gradient mechanism-based laser-assisted bonding (TG-
LAB) process, which can be used for the hermetic package of thermally sensitive …

The development of a solder-based vacuum bonding technique for micro-electro
mechanical systems (MEMS) applications is presented. A chip with a micro-sensor was …

With rapid progress of the performance improvement of portable electronic products such as
smart phones and electronic books, much attention has been focused on the three …

We propose and demonstrate a microfabrication processing sequence that enables wafer-
scale singulation, release and subsequent processing of microelectromechanical devices …

We investigated the wafer-level MEMS capping process for which cavity formation in Si
wafer was not required. Ni caps were formed by electrodeposition on 4" Si wafer and Ni rims …

To develop the MEMS cap bonding process without cavity formation, we electroplated Cu/Sn
rim structures and measured the bonding characteristics for the Cu/Sn rims of $25 {\sim} 400 …

Wafer level polymer packaging for MEMS is a cost-effective approach that is also compatible
with microelectronic packaging technologies. However, polymer packages are not hermetic …