This paper reports selective etching process of borosilicate glass by laser-induced deep
etching (LIDE) for through glass via (TGV) applications. Picosecond laser is used to modify …

A millimeter-wave substrate integrated waveguide (SIW) has been demonstrated using
micromachined tungsten-coated through glass silicon via (TGSV) structures. Two-step deep …

Abstract Design and fabrication of the through-glass via (TGV) based three-dimensional
(3D) spiral inductors in the fused silica substrates by a simpler electrochemical discharge …

Compared with silicon-based inductors, the inductors with through glass via (TGV)
technology have significantly improved in quality () factor. On the basis of TGV technology, a …

This paper presents, for the first time, substrate-integrated waveguides (SIWs) in ultra-thin
glass with through-package-vias (TPVs). An SIW operating at 20 GHz was designed in bare …

Easy-to-manufacture photosensitive glass ceramics are vital for wide applications due to
their superior thermal, mechanical and chemical properties from an industrial point of view …

A directional Through Glass Via (TGV) antenna is designed in a glass interposer layer for W-
band (75GHz-110GHz) wireless point-to-point chip communications with a center frequency …

A millimeter-wave substrate-integrated waveguide (SIW) was firstly demonstrated using the
micromachining of photoetchable glass (PEG) for 5G applications. A PEG substrate was …

An analytic model of the tapered differential through glass vias is proposed in this paper.
Each expression accounting for the via length, diameter, slope angle and pitch is derived …

In this paper, a through-glass-via (TGV) interposer for 2.5 D radio frequency (RF) integration
is presented. A coplanar waveguide (CPW) transmission line with grounded TGVs on one …