Nanoelectronics is changing the way the world communicates, and is transforming our daily
lives. Continuing Moore's law and miniaturization of low-power semiconductor chips with …

Polymer liner has been used in through-silicon-vias (TSVs) for smaller parasitic capacitance
and better thermo-mechanical performance. For the application in heterogeneous integrated …

In microelectronics, one of the main 3D integration strategies consists of vertically stacking
and electrically connecting various functional chips using through-silicon vias (TSVs). For …

3-D modeling of through-silicon-via (TSV) with sidewall scallops, combined with an element
birth and death technique, is explored in finite-element analysis (FEA) in this paper to …

Abstract In three-dimensional (3D) integration, liner deposition technique with excellent step
coverage is a challenge to realize through-silicon-vias (TSVs), especially for TSVs with high …

A comprehensive study of reliability failure modes in an advanced through-silicon via (TSV)
mid process flow is presented in Part I of this paper. This is the first time unique TSV mid …

Compared to conventional through-silicon-via (TSV) technology, coaxial TSVs can provide
better radio frequency (RF) transmission performance in terms of reduced transmission loss …

Low-k and high aspect ratio blind through-silicon-vias (TSVs) to be applied in “via-
last/backside via” 3-D integration paradigm were fabricated with polyimide dielectric liners …

Due to the mismatch between the coefficients of thermal expansion (CTE) of two adjacent
films, the residual stress was growing up during thermal cycling. The aim of this work is to …

Due to the advantages of ease of fabrication, low cost, and potential high reliability, through-
silicon-vias (TSVs) using low-resistivity silicon posts as conductors and circular polymer …