In this paper, we present Bi-Modal Cache-a flexible stacked DRAM cache organization
which simultaneously achieves several objectives:(i) improved cache hit ratio,(ii) moving the …

We demonstrate WDM-enabled all-passive optical row and column address selector
(RAS/CAS) circuits for use as optical static RAM (SRAM) bank peripherals in future optical …

New fine-grained 3D cache architectures have been recently proposed to embed more
memory on-chip and thus reduce off-chip memory accesses. These 3D architectures provide …

In this paper, we present Bi-Modal Cache-a flexible stacked DRAM cache organization
which simultaneously achieves several objectives:(i) improved cache hit ratio,(ii) moving the …

3D stacking is currently seen as a breakthrough technology for improving bandwidth and
energy efficiency in multi-core architectures. The expectation is to solve major issues such …

To address the problem of prohibitive cost of advanced fabrication technologies, one
solution consists in reusing masks to address a wide range of ICs. This could be achieved …

Heterogeneity, multiple on-chip processing elements, multithreading, intelligent caching
mechanisms, and compiler-assisted thread-level speculation are a few of the features of …

Three-dimensional integration circuits (3-D ICs) technology provides various opportunities
for new computer system architectures. Data prefetching, which can utilize the abundant …

Three-dimensional (3-D) integration technology dramatically increases the memory
bandwidth by stacking memory directly on the top of a processor. This paper proposes a …

With increasing silicon manufacturing capabilities, it is expected that chip multiprocessors
(CMPs) with thousands of cores will be ready before 2030. With increasing number of cores …