Flip-chip underfill process is a very important step in the flip-chip packaging technology
because of its great impact on the reliability of the electronic devices. In this technology …

The rapid development of computing software has facilitated multifarious research in
integrated circuit (IC) packaging. Complicated and complex processes can be visualized via …

The capillary flow is widely applied recently in many modern processes such as underfilling
of flip chip, crystal growth, flow in micro-fluidics, and a variety of other fields. In this study, a …

(57) ABSTRACT A microphone assembly includes a carrier, a silicon-based transducer, a
conducting element, and an underfill agent. The carrier has a first Surface holding an …

This article describes an analytical model for the prediction of the underfill flow
characteristics in a flip-chip package driven by capillary action. In this model, we consider …

This paper presents the simulation of pressurized underfill encapsulation process for high
I/O flip chip package. 3D model of flip chip packages is built using GAMBIT and simulated …

Capillary-driven micro flow allows liquid transport by interfacial force without external
pressure or momentum. Theoretical and experimental studies have been conducted to …

In the prediction of underfill flow in a flip-chip package, numerical methods are usually used
for flow analysis and simulation since analytical methods cannot meet the requirement for …

The reliability of low-K flip-chip packaging has become a critical issue owing to the low
strength and poor adhesion qualities of the low-K dielectric material when compared with …

The capillary rise of liquid in a cylinder bank is examined in order to study the capillary
pressure variation perpendicular to the direction of the cylinders. The calculations consider …