Ever since RoHS was implemented in 2006, Sn3. 0Ag0. 5Cu (SAC305) has been the
primary lead-free solder for attaching electronic devices to printed circuit boards (PCBs) …

Abstract For the common Cu-Sn interconnection system in microelectronics packaging, a
significant concern is the sporadic interfacial void formation within the Cu–Sn interface and …

Abstract Intermetallic compound (s)(IMC) that nucleates at the interface between solder and
Cu trace during a soldering reaction, is one of the most crucial factors for microelectronic …

Void nucleation is a critical issue in wetting because it negatively impacts the solder joint
and diminishes its electrical and mechanical properties. Generally, the Kirkendall effect …

This work investigated the effects of levelers on the electroplating performance and reliability
of copper pillar bumps (CPBs) on wafer. Under large current density, the usage of Janus …

The effects of Ni (P) thickness, δ Ni (P), on the interfacial reaction and high impact resistance
of Sn-3Ag-0.5 Cu/Au/Pd (P)/Ni (P)/Cu microelectronic solder joints were investigated. During …

Abstract Thermal reliability of Au/Pd/Cu and Au/Pd (4–6 wt.% P)/Cu trilayers in the
isothermal annealing at 180° C were investigated by X-ray photoelectron spectroscopy …

This study was conducted to investigate the microstructure, impurity distribution, and
mechanical reliability of copper pillar bumps (CPBs) by means of scanning electron …

The present study investigated the reaction behavior of the AuSn 4 intermetallic compound
in the Ni/Sn1. 8Ag+ Sn3Ag0. 5Cu/Au/Pd/Cu solder joint when subjected to multiple reflow for …

Abstract The Mg–Pt system is considered as a promising hydrogen storage material.
Surprisingly, its phase diagram is unknown hence application of this alloy very limited due to …