Modelling load transfer in single-lap adhesively bonded and hybrid (bolted/bonded) joints

E Paroissien, F Lachaud, S Schwartz - Progress in Aerospace Sciences, 2022 - Elsevier
An aerospace structure is built from the assembly of structural sub-components involving
joining technologies such as welding, mechanical fastening or adhesive bonding. The …

Analytical study and compensation for temperature drifts of a bulk silicon MEMS capacitive accelerometer

J He, J Xie, X He, L Du, W Zhou - Sensors and Actuators A: Physical, 2016 - Elsevier
An analytical study and a compensation structure for temperature drifts of bias and scale
factor of a bulk silicon MEMS capacitive accelerometer are presented. The analytical model …

An enriched finite element for the simplified stress analysis of an entire bonded overlap: continuum macro-element

S Schwartz, E Paroissien, F Lachaud - International Journal of Adhesion …, 2024 - Elsevier
A methodology for the formulation of the stiffness matrix of an enriched finite element, called
continuum macro-element (CME), representing for the full length of a bonded overlap and …

Stress analysis of adhesively-bonded single stepped-lap joints with functionally graded adherends based on the four-parameter fractional viscoelastic model

M Veisytabar, A Reza, Y Shekari - European Journal of Mechanics-A/Solids, 2023 - Elsevier
This paper presents a viscoelastic stress analysis of adhesively-bonded single stepped-lap
joints under tension with functionally graded adherends. This analysis is based on the four …

An improved four-parameter model with consideration of Poisson's effect on stress analysis of adhesive joints

W Jiang, P Qiao - Engineering Structures, 2015 - Elsevier
An improved four-parameter model considering Poisson's effect is presented to analyze
interface stresses of adhesively bonded joints. The existing theoretical models of adhesive …

Interfacial stress and crack propagation experimental study in mini-LED chip debonding

L Ma, Y Chen, Y Chen, M Hou, X Chen… - International Journal of …, 2024 - Elsevier
The ultra-miniaturization trend of chips presents new challenges for non-destructive peeling-
off techniques. This study models the mini-LED chip-UV film adhesive system as a micro …

Extended formulation of macro-element based modelling–Application to single-lap bonded joints

S Schwartz, É Paroissien, F Lachaud - Computers & Structures, 2024 - Elsevier
An extended formulation of the macro-element (ME) based models, representing for both
adherends and adhesive along the entire overlap in only one four-node element, is …

Elastic flexural analysis of adhesively bonded similar and dissimilar beams using refined zigzag theory and peridynamic differential operator

M Dorduncu, MK Apalak - International Journal of Adhesion and Adhesives, 2020 - Elsevier
This study investigates elastic flexural behavior of adhesively bonded similar and dissimilar
beams using Refined Zigzag Theory (RZT) and Peridynamic Differential Operator (PDDO) …

A generalized model for predicting stress distributions in thick adhesive joints using a higher-order displacement approach

TS Methfessel, W Becker - Composite Structures, 2022 - Elsevier
As typical elements in lightweight applications, adhesive bonds bring many practical
advantages over other joining technologies, such as their high strength-to-weight ratio, their …

Opening-mode fractures of a brittle coating bonded to an elasto-plastic substrate

FL Chen, X He, PA Prieto-Munoz, HM Yin - International Journal of …, 2015 - Elsevier
An elasto-plastic fracture model is presented to study the opening-mode fractures for an
alumina coating fully bonded to an aluminum substrate undergoing large tensile …