Void nucleation is a critical issue in wetting because it negatively impacts the solder joint
and diminishes its electrical and mechanical properties. Generally, the Kirkendall effect …

Due to the miniaturization of electronic devices, electromigration became one of the serious
reliability issues in lead-free solder joints. The orientation of the β-Sn grain plays an …

The effect of isothermal aging on the microstructure and shear strength of Sn3Ag0. 5Cu/Cu
(SAC305/Cu) solder joints were studied systematically. The single-lap shear samples of …

Electromigration (EM) causes intermetallic and void growth that decreases the reliability and
lifetime of solder joints. As a diffusion-controlled process, EM is highly dependent on the …

This paper describes the changes in microstructures and their effects on property
degradations in an environmentally friendly eutectic Snsingle bond0. 7Cu (wt.%) solder …

In this investigation, SnAgCu and SN100C solders were electromigration (EM) tested, and
the 3D laminography imaging technique was employed for in-situ observation of the …

The liquid/solid (L/S) interface of dissimilar metals is critical to the microstructure,
mechanical strength, and structural integrity of interconnects in many important applications …

Novel high operating temperature thermal interface materials (TIMs) in power electronics are
required to realize performance gains from the use of wide band‐gap (WBG) semiconductor …

Laboratory diffraction contrast tomography (LabDCT) is a laboratory-scale x-ray
microtomography technique that can be used to non-destructively map grains and grain …

The effect of solid-liquid electromigration on Cu-xNi/Sn-3.0 Ag-0.5 Cu/Cu-xNi (x= 0, 1.5 and
5 wt%) joints bonded at 260° C with electric density of 2.89× 10 2 A/cm 2 was investigated …