Transformer structure of bifilar primary winding with advanced common mode noise attenuation performance for isolated dc-dc converters

Q Huang, Y Yang, Z Ma, Y Lai… - 2023 IEEE Applied …, 2023 - ieeexplore.ieee.org
The transformer is one of the main common mode (CM) noise propagation paths in isolated
DC-DC converters. The impedances of the CM path of a transformer will transfer from …

Multi-physics coupling analysis of high-power IGBT module bonding wires fault considering stray inductance of main circuit

Y Wang, X Rong, C Yang, H Shi, J Zheng - Microelectronics Reliability, 2023 - Elsevier
The insulated gate bipolar transistor (IGBT) module is subjected to unbalanced electric-
thermal stress for a long time due to its own turn-on and turn-off, the fluctuation of processing …

A 3-D Temperature-Dependent Thermal Model of IGBT Modules for Electric Vehicle Application Considering Various Boundary Conditions

Y Lu, E Xiang, Y Jin, H Luo, H Yang… - IEEE Journal of …, 2024 - ieeexplore.ieee.org
With the development of power electronic converters (PECs), the thermal properties of high-
power insulated gate bipolar transistor (IGBT) module are of significant importance in the …

Modeling and Design Guideline of Optimal Split Inductance Range for Split-Output Power Module Considering Normal and Fault Conditions

H Gao, D Hai, L Xiang, H Luo, W Li… - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
Split-output structure outperforms the common halfbridge structure for silicon carbide (SiC)
applications in terms of operation efficiency increasing, crosstalk voltage suppression, and …

[PDF][PDF] 并联IGBT 占空比的温度特性建模与分析

黄海宏, 彭岚, 王海欣 - 电工技术学报, 2024 - dgjsxb.ces-transaction.com
摘要并联IGBT 是解决托卡马克(Tokamak) 装置中等离子体垂直位移快速控制电源容量逐渐增大
问题的有效途径. 而并联IGBT 之间的结温平衡是并联系统安全稳定运行的关键因素之一. 因此 …

Investigation on the Degradation Mechanism of Si/SiC Cascode Device Under Repetitive Short-Circuit Tests

Q Zhang, H Liu, Y Zhou - IEEE Open Journal of Power …, 2024 - ieeexplore.ieee.org
The Si/SiC Cascode device has been widely accepted in various applications, however, its
reliability issue still remains a major concern and needs to be extensively investigated. In …

Research on the Electro-Thermal–Mechanical Properties of IGBT Modules Under Different Bond Wire Failure Modes

H Ren, S Zhao, J Mu, W Wang, Z Han… - … on Electron Devices, 2024 - ieeexplore.ieee.org
Due to the coefficients of thermal expansion (CTE) mismatch between various materials, the
bond wire of insulated gate bipolar transistor (IGBT) module is prone to heel-cracking or lift …

Temperature duty cycle characteristics of parallel IGBTs

L Peng, H Huang, H Wang - Journal of Power Electronics, 2024 - Springer
IGBT parallel connections are an effective way to increase the capacity of power electronic
converters. The junction temperature balance between IGBTs is one of the key factors in the …

Research on Fast Design Method for Power Module Terminal RMS Current Capacity via Thermal Equivalent Model

H Gao, A Zhu, Y Jin, Y Xia, Q Yin, Z Zhao… - 2022 IEEE …, 2022 - ieeexplore.ieee.org
This paper proposes a power terminal design method to obtain a suitable RMS current
capacity to fit high-capacity power semiconductor modules. The thermal model considering …

A Novel Calculation Method for IGBT Junction Temperature Based on Fourier Transform

Z Xu, Y Zhang, H Wang, X Ge, Y Liao… - CPSS Transactions on …, 2023 - ieeexplore.ieee.org
Fast and accurate calculation of junction temperature is attractive for reliability evaluation of
insulated gate bipolar transistor (IGBT) module. However, in most of existing methods, a …