MnO2 nanowires modified reduced graphene oxide thick film cathode for aqueous zinc-ion prismatic battery

P Navaneeth, SD Krishnendu, SB TG… - Journal of Energy …, 2024 - Elsevier
Aqueous zinc-ion batteries are an excellent alternative to lithium-ion batteries that can meet
the energy requirements while also being safe and eco-friendly. However, developing a …

Unification of rheology of thixotropic yield stress fluids and screen printing properties of pastes

C Mao, Y Tian, X Zhou, J Bai, S Ma, H Wang - Colloids and Surfaces A …, 2024 - Elsevier
At present, the electrode width of solar cells has been successfully reduced to less than 20
µm. Ensuring its morphology and aspect ratio remains a major challenge to further reducing …

Investigating the Influence of Different Aprotic Processing Solvents for the PVdF Binder on the Microstructure and Electrochemical Performance of High-Load Positive …

C Gercek, J Kauling, B Heidrich, M Winter… - ACS Applied Energy …, 2024 - ACS Publications
State-of-the-art manufacturing of positive electrodes in lithium ion batteries is carried out in N-
methyl-2-pyrrolidone (NMP), an aprotic organic solvent which stands out for good wetting …

Effect of Silver Powder Microstructure on the Performance of Silver Powder and Front-Side Solar Silver Paste

X Yu, H Sun, Z Qian, W Li, W Li, F Huang, J Li, G Gan - Materials, 2024 - mdpi.com
Silver powder, as the primary component of solar silver paste, significantly influences
various aspects of the paste's performance, including printing, sintering, and conductivity …

An optimization strategy for improving the aspect ratio of screen printing electronic paste based on rheological properties

Y Tian, C Mao, X Zhou, H Zhang, L Yin, S Ma… - Colloids and Surfaces A …, 2024 - Elsevier
The wide application of electronic pastes in the field of information electronics puts forward
higher requirements for printability. As a key component to determine printability, there are …

A new method of TGVs for fast filling of metal paste

C Xu, S Li, Z Hu, J Wei, Y Liu, H Wang… - 2024 25th …, 2024 - ieeexplore.ieee.org
Through glass via (TGV) is a technology based on the wafer-level fabrication of glass
substrates to realize vertical interconnection of electrical signals, which has the advantages …

[引用][C] Thick-film–a mature technology at the cutting edge of advances in the electronics industry

GM Berube - IMAPSource Proceedings, 2023 - IMAPS