Electronic devices play a vital role in our lives and are expected to play an even bigger role
in the future considering their immense contribution in every field. Current trends are drifting …

The trend of continuing miniaturisation of microelectronics leads to new thermal
management challenges. A key point in the heat removal process development is to improve …

Packaging electronic devices is a growing challenge as device performance and power
levels escalate. As device feature sizes decrease, ensuring reliable operation becomes a …

We review the current state-of-the-art graphene-enhanced thermal interface materials for the
management of heat in the next generation of electronics. Increased integration densities …

Effective heat transfer is imperative in devices with high power densities, for which thermal
interface materials (TIMs) may be used to improve heat conduction across interfaces …

The application of liquid metal (LM) with high thermal conductivity in electronic thermal
management is an emerging hotspot, but leakage of LM can cause environmental pollution …

Thermal interface materials (TIMs) with high thermal conductivity, fluidic characteristics, and
surface wettability are crucial for the effective thermal management of high-power …

In recent years, the development of personal protective equipment (PPE) for health care
workers (HCWs) attracted enormous attention, especially during the pandemic of COVID-19 …

Using thermal interface materials (TIMs) is generally considered an effective way to reduce
thermal contact resistance. In this paper, effects of surface roughness, temperature and …

Thermal interface materials (TIMs) play a key role in reducing thermal resistance between
jointed solid surfaces in order to increase thermal transfer efficiency. A TIM is a thermally …