With the advancement of Moore's Law reaching its limits, advanced packaging technologies
represented by Flip Chip (FC), Wafer-Level Packaging (WLP), System in Package (SiP), and …

This work describes a Fast novel thermal analysis simulation tool for integrated circuits
(FANTASTIC), which is fully automated and relies on an enhanced version of the Multi-Point …

Residual lifetime estimation has gained a key point among the techniques that improve the
reliability and the efficiency of power converters. The main cause of failures are the junction …

A novel nonlinear model order reduction method is proposed for constructing one-port
dynamic compact models of nonlinear heat diffusion problems for ultra-thin chip stacking …

Thermal Feedback Blocks are a viable approach to perform thermal and electrothermal
simulations of electronics systems with very fast-switching inputs, for which the coupling of a …

We deal with the problem of identifying the parameters of an equivalent lumped RC multiport
network from time domain tabulated data of a corresponding distributed real eigenvalues …

This paper presents a model-order reduction technique to extract nonlinear dynamic
compact thermal models (DCTMs) with multiple (> 1) heat sources. The approach leads to …

A novel approach for constructing multi-port dynamic compact thermal models of nonlinear
heat diffusion in electronic components is presented, extending a technique previously …

In this paper, a novel parametric moment matching technique is proposed for efficiently
constructing accurate parametric compact thermal models for variable geometries. This …

Abstract Thermal Feedback Blocks represent an efficient means to perform thermal and
electrothermal analyses of power converters, for which the adoption of strategies relying on …