A review on advanced carbon-based thermal interface materials for electronic devices

J Khan, SA Momin, M Mariatti - Carbon, 2020 - Elsevier
Electronic devices play a vital role in our lives and are expected to play an even bigger role
in the future considering their immense contribution in every field. Current trends are drifting …

Heat and fluid flow in high-power LED packaging and applications

X Luo, R Hu, S Liu, K Wang - Progress in Energy and Combustion Science, 2016 - Elsevier
Light-emitting diodes (LEDs) are widely used in our daily lives. Both light and heat are
generated from LED chips and then transmitted or conducted through multiple packaging …

Present and future thermal interface materials for electronic devices

KM Razeeb, E Dalton, GLW Cross… - International Materials …, 2018 - Taylor & Francis
Packaging electronic devices is a growing challenge as device performance and power
levels escalate. As device feature sizes decrease, ensuring reliable operation becomes a …

Can Adhesion Energy Optimize Interface Thermal Resistance at a Soft/Hard Material Interface?

X Cheng, D He, M Zhou, P Zhang, S Wang, L Ren… - Nano Letters, 2023 - ACS Publications
Thermal resistance at a soft/hard material interface plays an undisputed role in the
development of electronic packaging, sensors, and medicine. Adhesion energy and phonon …

A simple and efficient numerical model for thermal contact resistance based on diffuse interface immersed boundary method

A Aalilija, CA Gandin, E Hachem - International Journal of Thermal …, 2021 - Elsevier
Thermal contact resistance between two adjacent materials is one of the major concerns in a
large variety of practical situations in heat transfer. The presence of this resistance yields a …

Interface deciphering for highly interfacial adhesion and efficient heat energy transfer

S Wang, Z Jiang, L Ren, X Zeng, R Sun - Applied Physics Letters, 2023 - pubs.aip.org
Interfacial adhesion and interfacial thermal resistance (ITR) are two critical factors in the
interfacial force and energy transfer, but it is difficult to simultaneously achieve the desirable …

[HTML][HTML] Modeling the replication of submicron-structured surfaces by micro injection molding

L Piccolo, K Puleo, M Sorgato, G Lucchetta, D Masato - Materials & Design, 2021 - Elsevier
The replication of submicron surface structures by micro injection molding is a crucial factor
in achieving advanced functionalities, such as antimicrobial resistance, in mass-produced …

Modeling of the thermal contact resistance time evolution at polymer–mold interface during injection molding: Effect of polymers' solidification

SC Somé, D Delaunay, J Faraj, JL Bailleul… - Applied Thermal …, 2015 - Elsevier
The prediction of the thermal contact resistance (TCR) evolution at polymer–mold interfaces
in injection process is a key point and presents a great challenge to thermal engineers for …

A new finite element model accounting for thermal contact conductance in laser transmission welding of thermoplastics

C Wang, H Liu, Z Chen, D Zhao, C Wang - Infrared Physics & Technology, 2021 - Elsevier
As the traditional laser transmission welding (LTW) generally ignores the influence of real
interfacial contact status on welding width, which is not accurate. For this problem, the …

Anti-leak, self-adaptive liquid metal-epoxy in-situ cured composites with ultra-low thermal resistance via flexible droplet inclusions

X Jia, S Wang, S Li, C Xu, J Du, J Zhou, Z Cheng… - Surfaces and …, 2023 - Elsevier
Generally, the function of thermal interface material (TIM) is filling rough surfaces,
eradicating air pockets, decreasing thermal resistance, and improving heat dissipating …