In high speed digital interconnects; signal attenuation is a result of both dielectric losses and
conductor losses. Previous works have showed in detail, the characterization and modeling …

High-speed chip-to-chip interconnect utilizing flex-circuit technology is investigated for
extending the lifetime of copper-based system-level channels. Proper construction of the flex …

Techniques for quantifying and minimizing the impact of differential signal phase skew
created by the non-homogeneous nature of FR4 PCBs are presented. Experimental results …

The effect of anisotropy of fiber-glass-filled epoxy resin composites, typically used as
laminate dielectrics for manufacturing of printed circuit boards (PCB) is studied. It is shown …

As a result of increasing signal transmission rates to as high band levels as several tens of
Gbps, skew induced by the difference in dielectric constant between the glass-cloth and the …

Weave-induced skew on printed wiring boards (PWB) for 10+ Gbps SerDes data rates can
be very significant. In this paper, we not only investigate weave-induced skew but also look …

Causal interpolation of frequency-domain experimental or simulation data known at discrete
points is essential for an accurate time-domain analysis. Hilbert transform has a central role …

A receiver for a three-lane 6-Gb/s/lane serial link has been developed in 28-nm CMOS
technology. It incorporates an intrapair skew compensator (IPSC) and a three-tap decision …

Since the last decade there have been many changes to legislation impacting the
manufacture of electrical and electronic equipment (EEE), proscribing a wider range of input …

Printed circuit board dielectric substrates are composite materials produced by embedding
fiber glass fabrics into epoxy resin. Because of this the medium in the PCB transmission …