BACKGROUND 0002 Integrated circuits are formed from a wafer or semi conductor
substrate over which are formed patterned micro electronics layers. In the processing of the …

11, 2003 1, 2004 2, 2004 3, 2004 T/2004 10, 2004 5/2005 2, 2006 10, 2006 10, 2006 2,
2007 9, 2007 4, 2008 10, 2008 12, 2008 12, 2008 1/2009 3, 2009 12, 2009 3, 2010 3, 2010 …

In embodiments, a hybrid wafer or substrate dicing process involving an initial laser scribe
and subsequent plasma etch is implemented for die singulation. The laser scribe process …

In one embodiment, die are singulated from a wafer having a back layer by placing the wafer
onto a first carrier substrate with the back layer adjacent the carrier substrate, forming …

The present invention provides a method for plasma processing a substrate, the method
comprising providing a process chamber having a wall; providing a plasma source adjacent …

A method of manufacturing a semiconductor chip according to an embodiment includes
forming on a semiconductor substrate a plurality of etching masks each including a …

BACKGROUND OF THE INVENTION ing the semiconductor devices mounted thereon or a
semi conductor-device forming surface of a wafer having semi Field of the Invention …

In one embodiment, die are singulated from a wafer having a back layer by placing the wafer
onto a first carrier substrate with the back layer adjacent the carrier substrate, forming …

Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality
of integrated circuits, are described. In an example, a plasma processing apparatus includes …

(57) ABSTRACT A method of producing a semiconductor chip, including the following steps
(a) to (d):(a) a step of, in the state of having laminated a mask integrated surface protective …