An improved interconnection system is described, such as for electrical contactors and
connectors, electronic device or module package assemblies, socket assemblies, and/or …

Sea of Leads (SoL) is an ultrahigh density (> 10/sup 4//cm/sup 2/) compliant chip
input/output (I/O) interconnection technology. SoL is fabricated at the wafer level to extend …

This paper presents gold passivated NiW compressible microinterconnects (CMIs) with 75
μm height and 150 μm in-line pitch. The CMIs are batch fabricated using CMOS-compatible …

Microsystems packages continue to demand lower cost, higher reliability, better
performance and smaller size. Compliant wafer-level interconnects show great potential for …

A wafer-level batch fabricated mechanically flexible interconnect (MFI) technology with 65-
μm vertical elastic range of motion is experimentally demonstrated. A metal alloy (NiW) with …

Compliant off-chip interconnects have both in-plane and out-of-plane compliance and are
able to accommodate the differential deflection between the die and the substrate or …

This paper explores different means by which the interconnect reliability is improved and
interposer warpage is decreased for an interposer-to-board integration platform using …

Sea of leads (SoL) process integration for the series of steps required to transform a fully
intact die at the wafer level to a die that is assembled onto a board is described. The primary …

A package for a die includes a porous wick layer disposed between the die and a substrate.
A sealed chamber between the die and substrate includes a phase-change fluid to transfer …

Several embodiments of massively parallel interface structures are disclosed, which may be
used in a wide variety of permanent or temporary applications, such as for interconnecting …