A two-step method of releasing microelectromechanical devices from a substrate is
disclosed. The first step comprises isotropically etching a silicon oxide layer sandwiched …

Current progress on micro/nanofabrication of dynamic mode cantilever sensors utilized as
scanning probes, and their diverse sensing applications within physics, chemistry, and …

It is difficult to meet all the different material and economical requirements posed to a MEMS
structural layer that can be integrated with the electronics on the same substrate using a …

High aspect ratio nanostructuring requires high precision pattern transfer with highly
directional etching. In this work, we demonstrate the fabrication of structures with ultra-high …

Introduction--Comparison of Photon and Thermal Detectors Performance--GaAs/AIGaAs
Based Quantum Well Intra-red Photodetector Focal Plane Arrays--GaInAs (P) Based Qwips …

Abstract Silicon nitride (Si 3 N 4) has a distinctive combination of material properties such as
high strength and fracture toughness, inherent phase stability, scratch resistance, low wear …

The effects of HF/NH4F, wet chemical etching on the morphology of individual surface
fractures (indentations, scratches) and of an ensemble of surface fractures (ground surfaces) …

Different types of planar photonic crystal cavities aimed at optimizing the far-field emission
pattern are designed and experimentally assessed by resonant scattering measurements …

We present the first demonstration of frequency conversion by simultaneous second-and
third-harmonic generation in a silicon photonic crystal nanocavity using continuous-wave …

We report on a versatile method to fabricate hollow gold nanobowls and complex gold
nanobowls (with a core) based on an ion milling and a vapor HF etching technique. Two …