Atomic layer deposition of oxide semiconductor thin films for transistor applications: a review

I Hwang, M Choe, D Jeon, IH Baek - Journal of Materials Chemistry C, 2024 - pubs.rsc.org
The accelerated evolution of artificial intelligence (AI) and semiconductor technologies has
fostered a mutually reinforcing relationship, whereby each technology has contributed to the …

High performance Si-MoS2 heterogeneous embedded DRAM

K Xiao, J Wan, H Xie, Y Zhu, T Tian, W Zhang… - Nature …, 2024 - nature.com
Abstract Embedded Dynamic RAM (eDRAM) has become a key solution for large-capacity
cache in high-performance processors. A heterogeneous two transistor capacitorless …

[HTML][HTML] A Review of Wide Bandgap Semiconductors: Insights into SiC, IGZO, and Their Defect Characteristics

Q Shangguan, Y Lv, C Jiang - Nanomaterials, 2024 - pmc.ncbi.nlm.nih.gov
Although the irreplaceable position of silicon (Si) semiconductor materials in the field of
information has become a consensus, new materials continue to be sought to expand the …

Capacitorless Dynamic Random Access Memory with 2D Transistors by One-Step Transfer of van der Waals Dielectrics and Electrodes

J Guo, Z Lin, X Che, C Wang, T Wan, J Yan, Y Zhu… - ACS …, 2025 - ACS Publications
Dynamic random access memory (DRAM) has been a cornerstone of modern computing,
but it faces challenges as technology scales down, particularly due to the mismatch between …

Low-power and scalable BEOL-compatible IGZO TFT eDRAM-based charge-domain computing

W Tang, J Liu, C Sun, Z Zheng, Y Liu… - … on Circuits and …, 2023 - ieeexplore.ieee.org
The rapid development of edge artificial intelligence (AI) raises high requirements for data-
intensive neural network (NN) computing and storage of edge devices, under a limited chip …

CMOS Logic and Capacitorless DRAM by Stacked Oxide Semiconductor and Poly-Si Transistors for Monolithic 3-D Integration

Z Wang, L Zheng, Z Lin, J Zhao, W Tang… - … on Electron Devices, 2024 - ieeexplore.ieee.org
In this work, we demonstrate capacitorless dynamic random access memory (DRAM) and
complementary metal-oxide–semiconductor (CMOS) logic circuits by vertically stacked ZnO …

Highly Scalable Vertical Bypass RRAM Using Interface-Type Resistive Switching Mechanism for V-Nand Memory Applications

G Han, J Seo, K Lee, D Kim, Y Seo… - … on Electron Devices, 2024 - ieeexplore.ieee.org
In this study, we present a vertical bypass resistive random access memory (VB-RRAM) that
integrates interface-type resistive switching RRAM with excellent memory characteristics for …

The impact of parasitic capacitance on the memory characteristics of 2T0C DRAM and new writing strategy

L Zheng, Z Wang, Z Lin, M Si - IEEE Electron Device Letters, 2023 - ieeexplore.ieee.org
In this work, we systematically study the impact of capacitive coupling effect on the memory
characteristics of 2T0C DRAM by both theoretical modeling and experiments. Then, based …

TFT-Based Near-Sensor In-Memory Computing: Circuits and Architecture Perspectives of Large-Area eDRAM and ROM CiM Chips

J Liu, W Tang, H Li, D Chen, W Long… - … on Circuits and …, 2023 - ieeexplore.ieee.org
In the era of intelligent IoT, huge amount of sensor data is collected and then transmitted to
processor elements in edge devices or cloud servers. The latency and energy consumption …

Recent progress in InGaZnO FETs for high-density 2T0C DRAM applications

S Yan, Z Cong, N Lu, J Yue, Q Luo - Science China Information Sciences, 2023 - Springer
In the past several decades, the density and performance of transistors in a single chip have
been increasing based on Moore's Law. However, the slowdown of feature size reduction …