Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
The objective of this review is to study the effect of minor alloying and impurity elements,
typically present in electronics manufacturing environment, on the interfacial reactions …
typically present in electronics manufacturing environment, on the interfacial reactions …
Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review
As the most common of the intermetallic compounds (IMCs) formed between Sn-based
solders and Cu substrates during the packaging of integrated circuits (ICs), Cu 6 Sn 5 is …
solders and Cu substrates during the packaging of integrated circuits (ICs), Cu 6 Sn 5 is …
Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: experimental and theoretical investigations
X Bi, X Hu, Q Li - Materials Science and Engineering: A, 2020 - Elsevier
Depositing Ni-based films on Cu pads has been accepted as an effective strategy to address
the reliability challenges due to the development of plastic ball grid array (PBGA) in …
the reliability challenges due to the development of plastic ball grid array (PBGA) in …
Interfacial reaction issues for lead-free electronic solders
The interfacial reactions between Sn-based solders and two common substrate materials,
Cu and Ni, are the focuses of this paper. The reactions between Sn-based solders and Cu …
Cu and Ni, are the focuses of this paper. The reactions between Sn-based solders and Cu …
First-principles investigation of the structural and electronic properties of Cu6− xNixSn5 (x= 0, 1, 2) intermetallic compounds
C Yu, J Liu, H Lu, P Li, J Chen - Intermetallics, 2007 - Elsevier
Cu6− xNixSn5 is an important intermetallic compound (IMC), which was known to greatly
improve the reliability of the solder joints in integrated circuits. However, the improvement …
improve the reliability of the solder joints in integrated circuits. However, the improvement …
Effects of multiple reflows on interfacial reaction and shear strength of SnAgCu and SnPb solder joints with different PCB surface finishes
P Liu, P Yao, J Liu - Journal of alloys and compounds, 2009 - Elsevier
The effects of multiple reflows (1, 2, 4, 6, 8, 10 numbers of reflow) on interfacial reaction and
shear strength of Sn3. 8Ag0. 7Cu (SAC) and Sn37Pb (SP) joints were systematically …
shear strength of Sn3. 8Ag0. 7Cu (SAC) and Sn37Pb (SP) joints were systematically …
Recent advances on Sn–Cu solders with alloying elements
Nowadays, a major concern of Sn–Cu based solder alloy today is focused on continuously
improving the comprehensive properties of the solder joints formed between the solders and …
improving the comprehensive properties of the solder joints formed between the solders and …
Interfacial reactions between Sn–0.4 Cu solder and Cu substrate with or without ENIG plating layer during reflow reaction
The interfacial reaction and morphology change of intermetallic compound (IMC) between
the Sn–0.4 wt.% Cu solder and two different kinds of substrates (Cu and electroless nickel …
the Sn–0.4 wt.% Cu solder and two different kinds of substrates (Cu and electroless nickel …
Comparison of interfacial reactions and isothermal aging of cone Ni-P and flat Ni-P with Sn3. 5Ag solders
J Xiao, F Wang, J Li, Z Chen - Applied Surface Science, 2023 - Elsevier
Electroless Ni-P plating has good prospects for application as a diffusion barrier layer for
interfacial reactions. In this study, the interfacial reaction between the microcone-structured …
interfacial reactions. In this study, the interfacial reaction between the microcone-structured …
A new investigation of the system Ni–P
C Schmetterer, J Vizdal, H Ipser - Intermetallics, 2009 - Elsevier
The binary system Ni–P is one of the constituents of the ternary system Ni–P–Sn which
provides the basic knowledge for understanding the interactions between Sn-based solders …
provides the basic knowledge for understanding the interactions between Sn-based solders …