Development of high-temperature solders
The development of lead-free solder alloys for high-temperature applications is required to
meet increasing demands for reliable replacements for lead-containing alloys. This paper …
meet increasing demands for reliable replacements for lead-containing alloys. This paper …
Nanomechanical characterization of Sn–Ag–Cu/Cu joints—Part 1: Young's modulus, hardness and deformation mechanisms as a function of temperature
VMF Marques, C Johnston, PS Grant - Acta materialia, 2013 - Elsevier
Nanoindentation has been used at room and elevated temperature to measure the spatial
distribution of mechanical properties within Pb-free solder ball joints. The hardness, Young's …
distribution of mechanical properties within Pb-free solder ball joints. The hardness, Young's …
Au-Sn SLID bonding—properties and possibilities
TA Tollefsen, A Larsson, OM Løvvik… - … materials transactions B, 2012 - Springer
Au-Sn solid–liquid interdiffusion (SLID) bonding is a novel and promising interconnect
technology for high-temperature applications. This article gives a review over previously …
technology for high-temperature applications. This article gives a review over previously …
Are intermetallics in solder joints really brittle?
CC Lee, PJ Wang, JS Kim - 2007 Proceedings 57th Electronic …, 2007 - ieeexplore.ieee.org
In nearly all soldering processes, it is the intermetallic (IMC) layer that bonds the solder to
the base metal. Thus, the IMC layer is necessary for any successful soldering operation …
the base metal. Thus, the IMC layer is necessary for any successful soldering operation …
Assembly and packaging technologies for high-temperature and high-power GaN devices
This paper gives a detailed analysis on the assembly and packaging technologies for the
state-of-the-art GaN-based high-electron-mobility transistors, which are suitable for high …
state-of-the-art GaN-based high-electron-mobility transistors, which are suitable for high …
[HTML][HTML] Recent studies of transient liquid phase bonding technology for electric vehicles
동환이， 민행허， 정원윤 - Journal of Welding and Joining, 2022 - e-jwj.org
Recently, interest in power modules is increasing in eco-friendly mobility such as electric
vehicles (EVs) and fuel cell electric vehicles (FCEVs). The power module is a key …
vehicles (EVs) and fuel cell electric vehicles (FCEVs). The power module is a key …
Combinatorial investigation of Al–Cu intermetallics using small-scale mechanical testing
In the past two decades, small-scale mechanical testing has become ubiquitous for
mechanical measurements, offering new opportunities to quantitatively probe the …
mechanical measurements, offering new opportunities to quantitatively probe the …
Nanomechanical characterization of Sn–Ag–Cu/Cu joints—Part 2: Nanoindentation creep and its relationship with uniaxial creep as a function of temperature
VMF Marques, B Wunderle, C Johnston, PS Grant - Acta Materialia, 2013 - Elsevier
In the first part of this study we reported the use of nanoindentation to evaluate the
mechanical properties of microphases formed within Sn–Ag–Cu-based solder joints as a …
mechanical properties of microphases formed within Sn–Ag–Cu-based solder joints as a …
High temperature interconnect and die attach technology: Au–Sn SLID bonding
TA Tollefsen, A Larsson, OM Løvvik… - IEEE Transactions …, 2013 - ieeexplore.ieee.org
Au-Sn solid-liquid interdiffusion (SLID) bonding is a novel and promising interconnect and
die attach technology for high temperature (HT) applications. In combination with silicon …
die attach technology for high temperature (HT) applications. In combination with silicon …
Electrochemical behavior of Zn-xSn high-temperature solder alloys in 0.5 M NaCl solution
Electrochemical behavior of Zn-xSn (x= 40 wt%, 30 wt%, 20 wt%) high-temperature lead-
free alloys was investigated in aerated 0.5 M NaCl solution by open circuit potential (OCP) …
free alloys was investigated in aerated 0.5 M NaCl solution by open circuit potential (OCP) …