[HTML][HTML] Experimental study of the evolution of tertiary dendritic arms and microsegregation in directionally solidified Al–Si–Cu alloys castings

LA de Souza Baptista, KG Paradela, IL Ferreira… - Journal of Materials …, 2019 - Elsevier
It is widely recognized that moderate addition of copper to aluminum, especially when
added together with silicon, significantly improves the resulting mechanical properties …

Improvement of surface properties of an Al–Sn–Cu plain bearing alloy produced by rapid solidification

MC Lucchetta, F Saporiti, F Audebert - Journal of Alloys and Compounds, 2019 - Elsevier
Al–Sn based alloys are widely used as plain bearings in several engineering applications,
particularly in internal combustion engines. The microstructures of these alloys are …

Sn–0.7 wt% Cu–(xNi) alloys: Microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient

BL Silva, N Cheung, A Garcia, JE Spinelli - Journal of Alloys and …, 2015 - Elsevier
In spite of being barely studied, the prediction of mechanical properties by controlling and
monitoring solidification thermal parameters (growth rate–v; cooling rate–T ̇; …

Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys

BL Silva, VCE da Silva, A Garcia, JE Spinelli - Journal of electronic …, 2017 - Springer
Samples extracted along the length of directionally solidified (DS) castings of three Sn-x Bi
alloys (x= 34 wt.% Bi, 52 wt.% Bi and 58 wt.% Bi) were first evaluated metallographically and …

Microstructure and properties of Cu− Ni− Si− Cr alloy fabricated by vacuum-assisted die casting via direct aging

J Zheng, S Pan, W Liang, X Chang, Y Wang… - Materials Science and …, 2024 - Elsevier
In this study, the Cu− 3.18 Ni− 0.75 Si− 0.28 Cr (wt.%) alloy was fabricated using vacuum-
assisted die casting (VADC), and the microstructure and properties of the alloy before and …

The effect of the growth rate on microsegregation: experimental investigation in hypoeutectic Al–Fe and Al–Cu alloys directionally solidified

ES Meza, F Bertelli, PR Goulart, N Cheung… - Journal of alloys and …, 2013 - Elsevier
Hypoeutectic Al–Cu and Al–Fe alloys were directionally solidified under unsteady-state heat
flow conditions in a water-cooled solidification setup. The experimental cooling curves …

Influence of process parameters on solidification length of twin-belt continuous casting

PK Penumakala, AK Nallathambi, E Specht… - Applied Thermal …, 2018 - Elsevier
A temperature based Finite Element Model is developed to estimate the evolution of
temperature, shell growth profiles and solidification length of a solidifying ingot in a twin-belt …

Thermal conductance at Sn-0.5 mass% Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth

R Oliveira, C Cruz, A Barros, F Bertelli… - Journal of Thermal …, 2022 - Springer
The use of Al for replacing high-cost alloying metals, like Ag, Bi, and Cu, as the second
major element in Sn-based alloys, arises as a promising alternative for the development of …

Dendritic growth, solidification thermal parameters, and Mg content affecting the tensile properties of Al-Mg-1.5 wt pct Fe alloys

LF Gomes, BL Silva, A Garcia, JE Spinelli - Metallurgical and Materials …, 2017 - Springer
Abstract Al-Mg-Fe alloys are appointed as favorable ones with respect to the costs and all
the required properties for successful vessel service. However, the experimental inter …

An inverse approach for the interfacial heat transfer parameters in alloys solidification

EP Oliveira, GM Stieven, EF Lins, JRP Vaz - Applied thermal engineering, 2019 - Elsevier
The interfacial heat transfer coefficient at metal/mold plays an important role for explaining
the energy extraction during solidification process. Experiments on heat transfer of binary …