Y Li - Journal of Microelectromechanical Systems, 2018 - ieeexplore.ieee.org
Polymers are ever more widely and more prominently used in microelectromechanical systems. They provide significant added value to the existing silicon-based technologies …
E Tatar, T Mukherjee, GK Fedder - Journal of …, 2017 - ieeexplore.ieee.org
Long-term gyroscope drift can be effectively removed by employing simultaneous on-chip stress and temperature compensation. Stress effects are significant and their inclusion …
T Omura, T Kurioka, CY Chen… - Journal of The …, 2024 - iopscience.iop.org
Electrodeposited Au-based micro-electromechanical systems (MEMS) capacitive accelerometers with Ti/Au multi-layered structures are promising devices for detecting very …
HS Hsieh, HC Chang, CF Hu… - Journal of …, 2011 - iopscience.iop.org
This study designs and implements a stress isolation guard-ring structure to improve the performances of the existing single proof-mass three-axis piezoresistive accelerometer …
XY Fang, CC Liu, XY Li, JH Wu, KM Hu… - IEEE Sensors …, 2023 - ieeexplore.ieee.org
Light detection and ranging (LiDAR) devices based on micro-electromechanical systems (MEMS) micromirrors have been promising sensors for automatic driving due to the …
Y Kim, SK Kang, SD Kim, SE Kim - Microelectronic engineering, 2012 - Elsevier
The demand for wafer stacking technology has been increasing significantly. Although many technical challenges of wafer stacking have improved greatly, there are still many …
N Khan, MJ Ahamed - Microsystem Technologies, 2020 - Springer
This paper presents beam modeling techniques for maximizing mechanical sensitivity of a butterfly resonator for gyroscopic applications. We investigate the geometric aspects of …
This work is concerned with the examination of one-dimensional stress effects in mode-split, open-loop MEMS gyroscopes with the goal to predict the sensitivity change under printed …
T Veske, D Erkan, E Tatar - 2023 IEEE 36th International …, 2023 - ieeexplore.ieee.org
This paper presents a high-resolution capacitive stress sensor array to precisely characterize the distributed MEMS packaging stress, for the first time. The unit stress …