A Review of Flexible Acceleration Sensors Based on Piezoelectric Materials: Performance Characterization, Parametric Analysis, Frontier Technologies, and …

Y Liao, H Yang, Q Liao, W Si, Y Chu, X Chu, L Qin - Coatings, 2023 - mdpi.com
Acceleration sensors are tools for detecting acceleration and serve purposes like fault
monitoring and behavior recognition. It is extensively employed in a variety of industries …

Challenges and issues of using polymers as structural materials in MEMS: A review

Y Li - Journal of Microelectromechanical Systems, 2018 - ieeexplore.ieee.org
Polymers are ever more widely and more prominently used in microelectromechanical
systems. They provide significant added value to the existing silicon-based technologies …

Stress effects and compensation of bias drift in a MEMS vibratory-rate gyroscope

E Tatar, T Mukherjee, GK Fedder - Journal of …, 2017 - ieeexplore.ieee.org
Long-term gyroscope drift can be effectively removed by employing simultaneous on-chip
stress and temperature compensation. Stress effects are significant and their inclusion …

Warpage study of electrodeposited-au Micro-components with Ti/au multi-layered structures toward MEMS applications

T Omura, T Kurioka, CY Chen… - Journal of The …, 2024 - iopscience.iop.org
Electrodeposited Au-based micro-electromechanical systems (MEMS) capacitive
accelerometers with Ti/Au multi-layered structures are promising devices for detecting very …

A novel stress isolation guard-ring design for the improvement of a three-axis piezoresistive accelerometer

HS Hsieh, HC Chang, CF Hu… - Journal of …, 2011 - iopscience.iop.org
This study designs and implements a stress isolation guard-ring structure to improve the
performances of the existing single proof-mass three-axis piezoresistive accelerometer …

Evaluation of residual stress in MEMS Micromirror Die surface mounting process and shock destructive reliability test

XY Fang, CC Liu, XY Li, JH Wu, KM Hu… - IEEE Sensors …, 2023 - ieeexplore.ieee.org
Light detection and ranging (LiDAR) devices based on micro-electromechanical systems
(MEMS) micromirrors have been promising sensors for automatic driving due to the …

Wafer warpage analysis of stacked wafers for 3D integration

Y Kim, SK Kang, SD Kim, SE Kim - Microelectronic engineering, 2012 - Elsevier
The demand for wafer stacking technology has been increasing significantly. Although many
technical challenges of wafer stacking have improved greatly, there are still many …

Design and development of a MEMS butterfly resonator using synchronizing beam and out of plane actuation

N Khan, MJ Ahamed - Microsystem Technologies, 2020 - Springer
This paper presents beam modeling techniques for maximizing mechanical sensitivity of a
butterfly resonator for gyroscopic applications. We investigate the geometric aspects of …

Modeling and experimental analysis of low-cost MEMS gyroscopes under PCB bending stress

W Mayer, A Küster, P Tritschler, T Hiller… - … on Inertial Sensors …, 2023 - ieeexplore.ieee.org
This work is concerned with the examination of one-dimensional stress effects in mode-split,
open-loop MEMS gyroscopes with the goal to predict the sensitivity change under printed …

Characterization of packaging stress with a capacitive stress sensor array

T Veske, D Erkan, E Tatar - 2023 IEEE 36th International …, 2023 - ieeexplore.ieee.org
This paper presents a high-resolution capacitive stress sensor array to precisely
characterize the distributed MEMS packaging stress, for the first time. The unit stress …