The development of miniaturization and high-density packaging of electronic components
demands heat dissipation components that are compact and exhibit high performance. An …

The advent of foldable and wearable devices, such as the Samsung Galaxy Fold (2019) and
Huawei Mate X (2019), require increased battery size and processor performance to drive …

Thermal ground planes (TGPs) are considered to be one the most promising thermal
management devices for cooling the high heat flux miniaturized power electronic devices …

Portable electronic products are continuously evolving towards compactness, integration,
and high performance, resulting in electronic chips generating significant heat in a confined …

The increasing heat flux of electronic systems, caused by the miniaturization and high
integration, has posed a huge challenge to efficient and effective thermal management …

Ultra-thin vapor chamber (UTVC) is an efficient heat transfer element that meets the heat
dissipation requirement of miniaturized electronics. In this study, a novel UTVC (0.5 mm …

In closed-loop phase-change systems, self-propelled jumping drops on a superhydrophobic
condenser offer a new mechanism to return the working fluid to the evaporator, eliminating …

A composite wick by covering a layer of sintered copper powder on micro V-grooves was
developed for two-phase heat transfer devices. Capillary performance of the composite …

The rapid advancement of high-performance electronic devices and high-capacity energy
storage has prompted the development of ultra-thin heat pipes with a higher heat transfer …

MEMS-based micro heat pipes (MHPs), as a novel heat pipe technology, is considered a
promising choice for thermal management applications in microelectronic circuits …