Despite being weak attractive forces, closed‐shell metallophilic interactions play important
roles in the Group 11 metal complexes on their diverse structural and physical features. A …

The quest for alternatives to cyclopentadienyl-based ligands has led to a recent renaissance
of N-centered donor ligands in various fields of organometallic and coordination chemistry …

The coating of complex three-dimensional structures with ultrathin metal films is of great
interest for current technical applications, particularly in microelectronics, as well as for basic …

Recent trends in the microelectronics industry are requiring the growth of metallic first row
transition metal films by the atomic layer deposition (ALD) method. The ALD growth of noble …

Coinage metals nitrogen chemistry has not been studied extensively until recently. The
focus of this review is the base-and halide-free complexes of the monoanionic nitrogen …

This review provides a comprehensive overview of the most recent progress in chemistry
and applications of metal complexes containing heteroallylic ligands such as amidinates …

The thermolysis of metal compounds incorporating amidinate-type ligands (RN (H) C (X)
NR, where R is any alkyl and X is an alkyl or an amido) show a great complexity and …

Chemical vapour deposition (CVD) and atomic layer deposition (ALD) are attractive
techniques for depositing a wide spectrum of thin solid film materials, for a broad spectrum of …

The continued dominance of copper in microelectronic manufacturing is due in part to the
techniques that have kept pace with the relentless trend towards smaller feature sizes. Pure …

A family of tin (II) guanidinate complexes of the general form [{RNC (NMe2) NR} 2Sn](R= iPr
(6), Cy (7), Tol (9) and Dipp (10)) and [{tBuNC (NMe2) NtBu} Sn {NMe2}](8) have been …