Abstract Field-Programmable Gate Arrays (FPGAs) have become one of the key digital
circuit implementation media over the last decade. A crucial part of their creation lies in their …

3-D sequential integration stands out from other 3-D schemes as it enables the full use of the
third dimension. Indeed, in this approach, 3-D contact density matches with the transistor …

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more
than twice as much new content, adding the latest developments in circuit models …

2011-12-06 Assigned to MONOLITHIC 3D INC. reassignment MONOLITHIC 3D INC.
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …

3D IC's promise to solve the 2D communication bottleneck, and enable the integration of
heterogeneous materials, devices and systems. There are at least three approaches to …

In this paper, we introduce a novel reconfigurable architecture, named 3D field-
programmable gate array (3D nFPGA), which utilizes 3D integration techniques and new …

Thanks to recent technology advances, the exploration of the vertical dimension has been
shown to be more than a dream for designers. Among those technologies, the vertical …

The critical operation needed to achieve monolithic three-dimensional integrated circuits is
obtaining single-crystal, device-quality semiconductor material for upper layer active circuits …

3D technology is an attractive solution for reducing wirelength in a field programmable gate
array (FPGA). However, trough silicon vias (TSV) are limited in number. In this paper, we …

In this paper, we introduce a novel reconfigurable architecture, named 3D nFPGA, which
utilizes 3D integration techniques and new nanoscale materials synergistically. The …