Nanotechnology-empowered flexible printed wireless electronics: A review of various applications of printed materials

A Eid, J Hester, Y Fang, B Tehrani… - IEEE …, 2018 - ieeexplore.ieee.org
In this article, the particular importance of nanotechnology-enabled materials associated
with additive manufacturing techniques for the realization of radio-frequency (RF) …

Chipless RFID Sensors for Bioimplants: A Comprehensive Review

P Sethy, SK Behera - IEEE Microwave Magazine, 2023 - ieeexplore.ieee.org
RFID technology has boomed in the area of biomedical applications, particularly in
wearable sensors and bioimplants. The placement of the tag externally or internally …

[HTML][HTML] A surrogate modelling strategy to improve the surface morphology quality of inkjet printing applications

JF Reyes-Luna, S Chang, C Tuck, I Ashcroft - Journal of Manufacturing …, 2023 - Elsevier
Current trends in manufacturing electronics feature digital inkjet printing as a key technology
to enable the production of customised and microscale functional devices. However …

Advances in wirelessly powered backscatter communications: From antenna/RF circuitry design to printed flexible electronics

C Song, Y Ding, A Eid, JGD Hester, X He… - Proceedings of the …, 2021 - ieeexplore.ieee.org
Backscatter communication is an emerging paradigm for pervasive connectivity of low-
power communication devices. Wirelessly powered backscattering wireless sensor networks …

Experimental characterization of a chip-level 3-D printed microjet liquid impingement cooler for high-performance systems

T Wei, H Oprins, V Cherman, S Yang… - IEEE Transactions …, 2019 - ieeexplore.ieee.org
The chip-level bare die direct liquid impingement jet cooling is regarded as a highly efficient
cooling solution for high-performance applications. Furthermore, it shows potential to be …

Additively manufactured “smart” rf/mm-wave packaging structures: A quantum leap for on-demand customizable integrated 5g and internet of things modules

X He, K Hu, Y Cui, R Bahr, B Tehrani… - IEEE Microwave …, 2022 - ieeexplore.ieee.org
5G and Internet of Things (IoT) technologies are rapidly expanding fields, utilizing cutting
edge processes and manufacturing techniques that enable wide connectivity coverage and …

Will 3d-semiadditive packaging with high conductive redistribution layer and process temperatures below 100° C enable new electronic applications?

T Tiedje, S Lüngen, K Nieweglowski… - 2018 7th Electronic …, 2018 - ieeexplore.ieee.org
The main challenge in 3D-additive packaging is the manufacturing of the conductive
redistribution layer. In most state-of-the-art and recent research, conductive polymer and …

Additive Manufacturing AiP Designs and Applications

TH Lin, RA Bahr, MM Tentzeris - Antenna‐in‐Package …, 2020 - Wiley Online Library
Additive manufacturing (AM) technologies are emerging fabrication methods that are
expanding rapidly in both industrial applications and academic research. The most popular …

Towards 3D-Printed Antenna in Package Solutions for THz-Applications

T Pfahler, G Gold, A Hofmann, J Schür… - 2024 IEEE …, 2024 - ieeexplore.ieee.org
This work investigates the feasibility of 3D-printing packages for integrated circuits (IC) with
built-in functional structures. The principle is demonstrated with a 300 GHz package …

IoT Application Technology Recent Development and the Engineering Talent Comprehensive Training Intelligent Framework

H Qiao, Z Xiao, J Yu - 2020 4th International Conference on …, 2020 - ieeexplore.ieee.org
By considering the IoT application technology as an example, this research work analyzes
the needs of social positions and adapts to the development of IoT technology, and …