Sn–Zn eutectic alloy has been considered as one of the lead-free solder materials that can
replace the toxic Sn–37Pb solder without increasing soldering temperature. This study …

The growth kinetics of Cu5Zn8 phase has been investigated under long-term thermal
exposure conditions using single shear lap joints. The Cu5Zn8 phase was formed by …

Three lead-free solder alloys, Sn–3Ag–0.5 Cu, Sn–3Ag–0.5 Cu–1Bi and Sn–3Ag–0.5 Cu–
3Bi, have been used to solder with Cu substrate in the current experiments to investigate the …

The shear strength of Sn–9Zn and Sn–9Zn–ZrO2 solder balls on electrodeposited Ni/Au
BGA joints after multiple reflows was investigated by shear tests and microstructural …

In electronic packaging, Sn-Zn lead-free solder has great application prospects. Sn-9Zn-xBi
alloys were obtained by smelting. This paper details a systematic study of the effect of Bi on …

The interfacial reaction of Sn-8Zn-3Bi-xSb (x= 0, 0.5, 1.0, 1.5) on Cu substrate has been
investigated under 150° C thermal aging up to 720 h and an interfacial reaction mechanism …

Soldering in the electrical and electronics industries has been elevated to a different level
that involves significant changes resulting from the introduction of lead-free solders …

Electrochemical corrosion behaviors of Sn-9Zn-3Bi-x Cr solder in 3.5 wt.% NaCl solution
were investigated in this work through potentiodynamic polarization measurements. After …

The effects of aging time on the mechanical properties of the Sn–9Zn–1.5 Ag–xBi lead-free
solder alloys are investigated using scanning electron microscopy (SEM), X-ray diffraction …

Microstructures of eutectic Sn–3.7 wt.% Ag–0.9 wt.% Zn solder were investigated under
different cooling rates (0.16 K/s, about 102K/s and about 104K/s). As learned from …