ML Lee, EA Fitzgerald, MT Bulsara, MT Currie… - Journal of applied …, 2005 - pubs.aip.org
This article reviews the history and current progress in high-mobility strained Si, SiGe, and Ge channel metal-oxide-semiconductor field-effect transistors (MOSFETs). We start by …
Three-dimensional (3D) integrated circuits (ICs), which contain multiple layers of active devices, have the potential to dramatically enhance chip performance, functionality, and …
W Liu, M Asheghi - Applied Physics Letters, 2004 - pubs.aip.org
Thermal engineering of many nanoscale sensors, actuators, and high-density thermomechanical data storage devices, as well as the self-heating in deep submicron …
W Liu, M Asheghi - 2006 - asmedigitalcollection.asme.org
Self-heating in deep submicron transistors (eg, silicon-on-insulator and strained-Si) and thermal engineering of many nanoscale devices such as nanocalorimeters and high-density …
Phonon Boltzmann transport equation (BTE) is a key tool for modeling multiscale phonon transport, which is critical to the thermal management of miniaturized integrated circuits, but …
JD Cressler, S Monfray, G Freeman, D Friedman… - 2018 - taylorfrancis.com
An extraordinary combination of material science, manufacturing processes, and innovative thinking spurred the development of SiGe heterojunction devices that offer a wide array of …
G Isella, D Chrastina, B Rössner, T Hackbarth… - Solid-State …, 2004 - Elsevier
We review the potential of low-energy plasma-enhanced chemical vapor deposition (LEPECVD) for the fabrication of strained Si and Ge heterostructures and devices. The …
C Prasad - IEEE Transactions on Electron Devices, 2019 - ieeexplore.ieee.org
The march toward dimensional scaling and higher performance has led the semiconductor industry to consider nonplanar topologies and different material systems. These choices …
As CMOS transistor gate lengths are scaled below 45 nm, thermal device design is becoming an important part of microprocessor engineering. Decreasing dimensions lead to …