A device-to-system perspective regarding self-heating enhanced hot carrier degradation in modern field-effect transistors: A topical review

MA Alam, BK Mahajan, YP Chen, W Ahn… - … on Electron Devices, 2019 - ieeexplore.ieee.org
As foreseen by Keyes in the late 1960s, the self-heating effect has emerged as an important
concern for device performance, output power density, run-time variability, and reliability of …

Improvement in self-heating characteristic by incorporating hetero-gate-dielectric in gate-all-around MOSFETs

YS Song, JH Kim, G Kim, HM Kim… - IEEE Journal of the …, 2020 - ieeexplore.ieee.org
For improving self-heating effects (SHEs) in gate-all-around metal-oxide-semiconductor field-
effect transistors (GAA MOSFETs), hetero-gate-dielectric (HGD) is utilized. The HGD consists …

The impact of self-heating on HCI reliability in high-performance digital circuits

H Jiang, SH Shin, X Liu, X Zhang… - IEEE Electron Device …, 2017 - ieeexplore.ieee.org
While many groups attribute the greatly accelerated (ie, excess) HCI degradation in modern
transistors to the difference between the peak temperature and the average temperature (ΔT …

Integrated modeling of self-heating of confined geometry (FinFET, NWFET, and NSHFET) transistors and its implications for the reliability of sub-20 nm modern …

W Ahn, SH Shin, C Jiang, H Jiang, MA Wahab… - Microelectronics …, 2018 - Elsevier
The evolution of transistor topology from planar to confined geometry transistors (ie, FinFET,
Nanowire FET, Nanosheet FET) has met the desired performance specification of sub-20 nm …

Self-heating mitigation of TreeFETs by interbridges

CJ Tsen, CC Chung, CW Liu - IEEE Transactions on Electron …, 2022 - ieeexplore.ieee.org
Adding interbridges (IBs) as additional channels between nanosheets (NSs) can reduce not
only the maximum temperature in local hotspot of device but also the junction temperature …

Investigation of self-heating effects in gate-all-around MOSFETs with vertically stacked multiple silicon nanowire channels

JY Park, BH Lee, KS Chang, DU Kim… - … on Electron Devices, 2017 - ieeexplore.ieee.org
The self-heating effects (SHEs) in gate-all-around (GAA) MOSFETs with vertically stacked
silicon nanowire (SiNW) channels are investigated. Direct observations using thermal …

A novel TCAD-based thermal extraction approach for nanoscale FinFETs

US Kumar, VR Rao - IEEE Transactions on Electron Devices, 2017 - ieeexplore.ieee.org
Self-heating and thermal modeling in fin-shaped FETs (FinFETs) are studied in this brief
using calibrated 3-D TCAD simulations. Using the second order R th C th network extraction …

High-sensitivity waveguide-integrated bolometer based on free-carrier absorption for Si photonic sensors

J Shim, J Lim, DM Geum, JB You, H Yoon, JP Kim… - Optics …, 2022 - opg.optica.org
Conventional photon detectors necessarily face critical challenges regarding strong
wavelength-selective response and narrow spectral bandwidth, which are undesirable for …

A predictive model for IC self-heating based on effective medium and image charge theories and its implications for interconnect and transistor reliability

W Ahn, H Zhang, T Shen, C Christiansen… - … on Electron Devices, 2017 - ieeexplore.ieee.org
Spatially resolved precise prediction of local temperature T (x, y, z) is essential to evaluate
Arrhenius-activated interconnect (eg, electromigration) and transistor reliability (eg, NBTI …

Thermal SPICE modeling of FinFET and BEOL considering frequency-dependent transient response, 3-D heat flow, boundary/alloy scattering, and interfacial thermal …

CC Chung, HH Lin, WK Wan… - IEEE Transactions on …, 2019 - ieeexplore.ieee.org
High device density and high power density intensify the self-heating effect in scaled FinFET
circuits to degrade both device and back-end-of-line (BEOL) reliability. The boundary …