This article presents a cost-effective thermal characterization approach that relies on temperature measurements and numerical simulations to solve an inverse heat transfer …
Increasing power densities in modern-day power electronic systems is pushing electronic components to their thermal limits, warranting the need for accurate thermal modelling …
C Mentin, I Recepi, T Polom - 2020 26th International Workshop …, 2020 - ieeexplore.ieee.org
3D finite element analyses of high fidelity and simplified power semiconductor package models are compared to identify essential model features. The paper investigates interaction …