The development of big data and artificial intelligence technology is increasing the need for
electronic devices to become smaller, cheaper, and more energy efficient, while also having …

In this study, the recent advances and trends in Cu–Cu hybrid bonding will be investigated.
Emphasis is placed on the definition, kinds, advantages and disadvantages, challenges …

A surface creep model is presented for analyzing Cu-to-Cu direct bonding under thermal
compression. The driving force is a pressure gradient, which squeezes layers of atoms to fill …

Imaging sensing holds a remarkable place in modern electronics and optoelectronics for the
complementary metal-oxide-semiconductor integration of high-speed optical …

The novel low-temperature Cu/SiO 2 hybrid bonding scheme using cluster-Ag passivation
has been proposed in this study for the heterogeneous integration application. With the …

We have developed the novel fabrication process that has realized the robust ultra-fine
pitch, 1 μm pitch, wafer level face-to-face Cu-Cu hybrid bonding. For the stable electrical …

We adopted (111)-oriented Cu with high surface diffusivity to achieve low-temperature and
low-pressure Cu/SiO2 hybrid bonding. Electroplating was employed to fabricate arrays of Cu …

Copper joints have replaced solder interconnects in integrated circuits due to their great
electrical properties and lower-temperature processing. To isolate Cu from oxidizing during …

This article focuses on the 3-D modeling methodology development of the wafer-to-wafer
hybrid bonding (W2W-HB) annealing process. With its successful application in a 2-stack …

Because of various purposes and high dynamic range (HDR) of brightness of objects in
automotive applications, HDR image capture is a primary requirement. In this article, HDR …