Low-temperature curable photosensitive polyimide (PSPI) materials have attracted
widespread attention in advanced packaging, serving as key insulating dielectric materials …

In the post-Moore era, advanced electronic packaging technology emerges as a prominent
direction for the future evolution of semiconductor industry. Nevertheless, warpage remains …

Laser debonding offers several advantages such as precision, speed, minimal damage, and
being noncontact. We investigated the feasibility of utilizing laser processing technology in …

In this article, a universal and concise theoretical model is proposed to quantify the effect of
gravity on packaging warpage by considering the competition between the thermal and …

In this chapter, the manufacture for reliability of Fan-out Packages is discussed from a
perspective of the panel-level packaging process. During processing, the material interfaces …

In order to meet demands for high-density, cost-efficient and highly flexible packages, a
package method is developed to support high-performance computing and artificial …

Photosensitive polyimide (PSPI) has been widely used in advanced microelectronic
packaging as a buffer coating, passivation layer, alpha particle barrier and interlayer …

Traditional heterogeneous integrated package structure actually uses several complete IC
packages, while the final heterogeneous integrated package structure is completed by …

The 2. xD packaging have been an attracting technology for high-performance computing
such as generative AI. We have addressed combining organic interposer and embedded …

Glass based rigid carriers are now essential for building present-day high-performance
semiconductor packages with Package on Package (PoP), chiplets, stacked 2D~ 3D …