US5659952A - Method of fabricating compliant interface for semiconductor chip - Google
Patents US5659952A - Method of fabricating compliant interface for semiconductor chip …

US6297548B1 - Stackable ceramic FBGA for high thermal applications - Google Patents
US6297548B1 - Stackable ceramic FBGA for high thermal applications - Google Patents …

An apparatus and a method for providing a heat sink on an upper surface of a
semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a …

4,604,644 8/1986 Beckham et al.... 357/80 Stiffener using a dielectric adhesive, with the
conductive t 3/1989 Okuaki al.". 3.400 traces on the flexible circuit facing toward the stiffener …

(57) ABSTRACT A Substrate is provided with Vias communicating with Surface contacts or
bumps. Joining material paste is forced through holes in a Screen onto an area array of the …

Semiconductor device packages or integrated circuit packages typically contain Small
integrated circuits on a Silicon Substrate, or the like, typically referred to as IC chips or die or …

A process for forming a thermally enhanced Chip On Board semiconductor device (10) with
a heat sink (30) is described. In one aspect, a thermally conducting filled gel elastomer …

An epoxy material suitable for no-flow underfilling processes with high glass transition
temperature can be obtained by curing a solvent free formulation containing an epoxy resin …

A method of encapsulating a semiconductor device. The encapsulation method includes a
semiconductor chip package assembly having a spacer layer between a top surface of a …

A microelectronic assembly such as an assembly of a semiconductor chip and mounting
substrate is encapsulated by applying an encapsulant to the assembly while maintaining the …