(57) ABSTRACT A method for making an interposer includes forming a plurality of wire
bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is …

A microelectronic package includes a mounting structure, a microelectronic element
associated with the mounting structure, and a plurality of conductive posts physically …

US PATENT DOCUMENTS component with the conductive elements of the second com
3,214,827. A 1 1/1965 Phohofsky ponent with the metallic nanoparticles disposed therebe …

(57) ABSTRACT A packaged microelectronic element includes a microelec tronic element
having a front Surface and a plurality of first Solid metal posts extending away from the front …

US7462936B2 - Formation of circuitry with modification of feature height - Google Patents
US7462936B2 - Formation of circuitry with modification of feature height - Google Patents …

(57) ABSTRACT A method of making an assembly can include juxtaposing a top surface of a
first electrically conductive element at a first surface of a first substrate with a top surface of a …

(57) ABSTRACT A microelectronic package includes a microelectronic ele ment having
faces and contacts, a flexible Substrate overlying and spaced from a first face of the …

(57) ABSTRACT A microelectronic assembly includes a first Surface and a first thin
conductive element exposed at the first surface and hav ing a face comprising first and …

Provisional application No. 60/517,179, filed on Nov.(57) 4, 2003. A microelectronic
assembly incorporates units stacked one above the other and may include a plurality of …

A packaged microelectronic element includes connection component incorporating a
dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) …