[HTML][HTML] Opportunities and challenges of 2D materials in back-end-of-line interconnect scaling
As the challenges in continued scaling of the integrated circuit technology escalate every
generation, there is an urgent need to find viable solutions for both the front-end-of-line …
generation, there is an urgent need to find viable solutions for both the front-end-of-line …
Plasma processing of low-k dielectrics
This paper presents an in-depth overview of the present status and novel developments in
the field of plasma processing of low dielectric constant (low-k) materials developed for …
the field of plasma processing of low dielectric constant (low-k) materials developed for …
Mechanical stability of porous low-k dielectrics
This paper reviews the mechanical and fracture properties of porous ultralow-k dielectrics
with the focus on chip package interaction related issues. It is shown that the mechanical …
with the focus on chip package interaction related issues. It is shown that the mechanical …
Poly (vinylidene fluoride) foams: a promising low-k dielectric and heat-insulating material
In this study, we used a batch-foaming method to prepare closed-cell poly (vinylidene
fluoride)(PVDF) foams with tailored microcellular structures. This is a simple, cost-effective …
fluoride)(PVDF) foams with tailored microcellular structures. This is a simple, cost-effective …
[图书][B] Metrology and Diagnostic Techniques for Nanoelectronics
Z Ma, DG Seiler - 2017 - taylorfrancis.com
Nanoelectronics is changing the way the world communicates, and is transforming our daily
lives. Continuing Moore's law and miniaturization of low-power semiconductor chips with …
lives. Continuing Moore's law and miniaturization of low-power semiconductor chips with …
[图书][B] Thin films and coatings: Toughening and toughness characterization
S Zhang - 2015 - books.google.com
Thin Films and Coatings: Toughening and Toughness Characterization captures the latest
developments in the toughening of hard coatings and in the measurement of the toughness …
developments in the toughening of hard coatings and in the measurement of the toughness …
Environmentally assisted cracking in silicon nitride barrier films on poly (ethylene terephthalate) substrates
A singular critical onset strain value has been used to characterize the strain limits of barrier
films used in flexible electronics. However, such metrics do not account for time-dependent …
films used in flexible electronics. However, such metrics do not account for time-dependent …
The effect of water uptake on the mechanical properties of low-k organosilicate glass
Water uptake in porous low-k dielectrics has become a significant challenge for both back-
end-of-line integration and circuit reliability. The influence of absorbed water on the …
end-of-line integration and circuit reliability. The influence of absorbed water on the …
Effect of accelerated hydrothermal aging on the durability of Si-based dielectric thin films
S Rubeck, V Cartailler, V Coutellier, G Imbert… - Microelectronic …, 2022 - Elsevier
Extensive reliability testing is performed on microelectronic products nowadays to ensure full
life cycle operation. Accelerated hydrothermal aging is used to evaluate product sensitivity to …
life cycle operation. Accelerated hydrothermal aging is used to evaluate product sensitivity to …
In situ observation of water behavior at the surface and buried interface of a low-k dielectric film
Water adsorption in porous low-k dielectrics has become a significant challenge for both
back-end-of-line integration and reliability. A simple method is proposed here to achieve in …
back-end-of-line integration and reliability. A simple method is proposed here to achieve in …