2015-09-02 Assigned to X-Celeprint Limited reassignment X-Celeprint Limited
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …

(57) ABSTRACT A method for selectively transferring active components from a source
Substrate to a destination Substrate includes provid ing a source Substrate having a process …

2015-09-24 Assigned to X-Celeprint Limited reassignment X-Celeprint Limited
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …

US10153256B2 - Micro-transfer printable electronic component - Google Patents US10153256B2
- Micro-transfer printable electronic component - Google Patents Micro-transfer printable …

A component includes a plurality of electrical connections on a process side opposed to a
back side of the component. Each electrical connection includes an electrically conductive …

(57) ABSTRACT A method for making an interposer includes forming a plurality of wire
bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is …

See application? le for Complete Seam}; hist'ory providing a microelectronic package
having a substrate, a' microelectronic element overlying the substrate and at least (56) …

A structure may include bond elements having bases joined to (51) Int. Cl. conductive
elements at a first portion of a first Surface and end HOIL 23/02(2006.01) surfaces remote …

A microelectronic package includes a mounting structure, a microelectronic element
associated with the mounting structure, and a plurality of conductive posts physically …

US PATENT DOCUMENTS component with the conductive elements of the second com
3,214,827. A 1 1/1965 Phohofsky ponent with the metallic nanoparticles disposed therebe …