US8786060B2 - Semiconductor package integrated with conformal shield and antenna -
Google Patents US8786060B2 - Semiconductor package integrated with conformal shield and …

(57) ABSTRACT A microphone system has a base with at least one electrical port for
electrically communicating with an external device. The system also has a solid metal lid …

(57) ABSTRACT A semiconductor package integrated with conformal shield and antenna is
provided. The semiconductor package includes a semiconductor element, an …

A package of a MEMS microphone is suitable for being mounted on a printed circuit board.
The package includes a substrate, at least one MEMS microphone, and a conductive …

Packaged microelectronic elements are provided. In an exem plary embodiment, a
microelectronic element having a front face and a plurality of peripheral edges bounding the …

2008/0314147 A1 12/2008 Nasiri et al. 7,051,590 B1 5, 2006 Lemkin et al. 2009 OO64780
A1 3/2009 Coronato et al. 7,093,487 B2 8/2006 Mochida 2009/0140606 A1 6/2009 Huang …

A semiconductor package and a manufacturing method thereof are provided. The
semiconductor package includes a first substrate, a second substrate, an interposer …

US PATENT DOCUMENTS 5,679,977 A 10, 1997 Khandros et al. 5,688,716 A 1 1/1997
DiStefano et al. 3,761,782 A 9, 1973 Youmans 5,703,400 A 12/1997 Wojnarowski et al …

One example includes an integrated circuit including at least one electrical interconnects
disposed on an elongate are extending away from a main portion of the integrated circuit …

BACKGROUND Microelectromechanical systems (MEMS) are a field of growth in the global
semiconductor business. MEMS com ponents and sensors may be used in the fast-growing …