BACKGROUND The present disclosure relates to semiconductor device design,
manufacture and packaging methods to improve elec trical current delivery into a …

A dynamic system coupled with “pre-Silicon” design methodologies and “post-Silicon”
current optimizing programming methodologies to improve and optimize current delivery into …

Embodiments of present invention include a method and apparatus of estimating power
supply of a 3DIC. The method particularly includes obtaining current information and lay out …

A dynamic system coupled with “pre-Silicon” design methodologies and “post-Silicon”
current optimizing programming methodologies to improve and optimize current delivery into …

A system and method of operating an integrated circuit (IC) having a fixed layout of one or
more blocks having one or more current sources therein that draw electrical current from a …

A dynamic system coupled with “pre-Silicon” design methodologies and “post-Silicon”
current optimizing programming methodologies to improve and optimize current delivery into …

(57) ABSTRACT A method for forming an integrated device includes follow ing operations. A
first circuit is provided. The first circuit has a first connecting path, a plurality of second …

US9021407B2 - Signal path of a multiple-patterned semiconductor device - Google Patents
US9021407B2 - Signal path of a multiple-patterned semiconductor device - Google Patents …

BACKGROUND The semiconductor industry is producing more and more capable
components with Smaller and Smaller feature sizes. Due to the increased demand for highly …

A system includes a processor configured to determine a power parameter associated with a
cell in an integrated circuit (IC) layout diagram. In response to the determined power …