Fine Pitch Aluminum Hybrid Bonding: Overcoming the Challenges in Plating, Passivation and Bonding
Aluminium to Aluminium (Al-Al) direct bonding is CMOS line compatible and is comparable
to gold (Au) and copper (Cu) due to metal cross-contamination in a process line. The Au-Au …
to gold (Au) and copper (Cu) due to metal cross-contamination in a process line. The Au-Au …
Aluminum-Aluminum Wafer Level Thermo Compression Bonding Using Thick Electroplated Aluminum Bonding Frames
Wafer bonding is crucial in semiconductor manufacturing, integrating diverse materials and
creating complex devices. Aluminum thermo-compression bonding (Al TCB) is promising for …
creating complex devices. Aluminum thermo-compression bonding (Al TCB) is promising for …