The influences of In element on microstructure and properties of Sn–Bi based lead-free
solder were investigated in this study. With In element addition, the amount of primary Sn …

In the present work, the effects of Bi addition on the microstructure, solderability, and
mechanical properties of Sn-Zn-Cu lead-free solder were studied. The composition of Sn-Zn …

Abstract Sn58-xBi-xAl-xZn were prepared by adding different addition (x= 0, 1.0, 2.0, and 3.0
wt%) of Al and Zn, and their response to melting point, microstructure, phase structure and …

The development of lead-free solders has emerged as one of the key issues in the
electronics packaging industries. Sn―Zn―Bi eutectic alloy has been considered as one of …

Abstract Sn9ZnxBixCu (x= 0, 1.0, 2.0, 3.0 and 4.0 wt%) solder alloys were prepared by
adding different contents of Bi and Cu elements, and the effects of Bi and Cu addition on the …

The influences of different Ce content on the properties of Sn–9Zn lead-free solder were
investigated. The results indicate that Ce plays an important role not only in the structure and …

The influences of different Ga content on the properties of Sn–9Zn lead-free solder were
investigated. The results indicate that Ga plays an important role not only in the structure and …

The ternary Sn–Zn–Cu system is of interest for the electronic solder applications. Its liquidus
projection was experimentally determined and the system was thermodynamically modeled …

The formation of intermetallic reaction layers and their influence on shear strength and
fractography was investigated between the Zn–Sn–Cu–Bi (ZSCB) and Cu substrate during …

Liquid metal battery (LMB) has raised extensive interest in the field of large-scale energy
storage applications. The Zn-based LMB composed of inexpensive Zn and low-temperature …