Advances on thermally conductive epoxy‐based composites as electronic packaging underfill materials—a review
The integrated circuits industry has been continuously producing microelectronic
components with ever higher integration level, packaging density, and power density, which …
components with ever higher integration level, packaging density, and power density, which …
A critical review of the preparation strategies of thermally conductive and electrically insulating polymeric materials and their applications in heat dissipation of …
Nowadays, the local heat accumulation of electronic components not only restricts the
further miniaturization and integration of electronic devices but also seriously affects the …
further miniaturization and integration of electronic devices but also seriously affects the …
Joint‐inspired liquid and thermal conductive interface for designing thermal interface materials with high solid filling yet excellent thixotropy
Z Xie, Z Dou, D Wu, X Zeng, Y Feng… - Advanced Functional …, 2023 - Wiley Online Library
For advanced thermal interface materials (TIMs), massive inorganic addition for high
isotropic thermal conductivities conflicts with suitable rheological viscosity for low contact …
isotropic thermal conductivities conflicts with suitable rheological viscosity for low contact …
An asymmetric sandwich structural cellulose-based film with self-supported MXene and AgNW layers for flexible electromagnetic interference shielding and thermal …
Flexible cellulose-based conductive films reveal high potential in electromagnetic
interference (EMI) shielding and thermal management applications. However, the high …
interference (EMI) shielding and thermal management applications. However, the high …
Thermal conductivity of polymer-based composites: Fundamentals and applications
Thermal management is critical to the performance, lifetime, and reliability of electronic
devices. With the miniaturization, integration and functionalization of electronics and the …
devices. With the miniaturization, integration and functionalization of electronics and the …
One-dimensional metal nanostructures: from colloidal syntheses to applications
This Review offers a comprehensive review of the colloidal synthesis, mechanistic
understanding, physicochemical properties, and applications of one-dimensional (1D) metal …
understanding, physicochemical properties, and applications of one-dimensional (1D) metal …
A review of the thermal conductivity of silver-epoxy nanocomposites as encapsulation material for packaging applications
Thermal management has been playing an important role in electronic encapsulation
because large heat fluxes need to be dissipated from high density/high-power integrated …
because large heat fluxes need to be dissipated from high density/high-power integrated …
Silver nanowires: Synthesis technologies, growth mechanism and multifunctional applications
P Zhang, I Wyman, J Hu, S Lin, Z Zhong, Y Tu… - Materials Science and …, 2017 - Elsevier
Silver nanowires have attracted a lot of attention in both academia and industry because of
their potential applications in many electronic devices. In the past decade, there have been …
their potential applications in many electronic devices. In the past decade, there have been …
Construction of 3D boron nitride nanosheets/silver networks in epoxy-based composites with high thermal conductivity via in-situ sintering of silver nanoparticles
Polymer-based thermal conductive composites (PTCs) with good thermal and mechanical
properties are highly appreciated in the thermal management of modern electronic devices …
properties are highly appreciated in the thermal management of modern electronic devices …
Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability
Epoxy (EP) composites with comprehensive good processability, low coefficient of thermal
expansion (CTE), and high thermal conductivity, but electrical insulation properties are …
expansion (CTE), and high thermal conductivity, but electrical insulation properties are …