In this study, we report on the feasibility of formation of nickel/tin solder pads and bus bars directly electroplated onto the aluminum screen-printed rear metallization layer of silicon …
Low cost concept based on the porous silicon technology is shown to be well suitable for integrating monolithically the photonic devices on a standard silicon wafers by using …
K Kholostov, A Klyshko, D Ciarniello… - 2014 IEEE 64th …, 2014 - ieeexplore.ieee.org
In this work we report the application of the selective wet processing technique based on dynamic liquid meniscus for copper pillar bumps (CPB) plating. The industrial plating of …
In this work we demonstrate a new selective metallization technique to perform localized plating on the screen-printed Al contact using the innovative approach based on Dynamic …
This Ph. D. thesis is focused on the development and optimization of front and rear side metallization of industrial silicon solar cells. The commonly adopted screenprinted silver …