Defect engineering in SiC technology for high-voltage power devices

T Kimoto, H Watanabe - Applied Physics Express, 2020 - iopscience.iop.org
Major features of silicon carbide (SiC) power devices include high blocking voltage, low on-
state loss, and fast switching, compared with those of the Si counterparts. Through recent …

Material science and device physics in SiC technology for high-voltage power devices

T Kimoto - Japanese Journal of Applied Physics, 2015 - iopscience.iop.org
Power semiconductor devices are key components in power conversion systems. Silicon
carbide (SiC) has received increasing attention as a wide-bandgap semiconductor suitable …

Dislocations in 4H silicon carbide

J Li, G Yang, X Liu, H Luo, L Xu, Y Zhang… - Journal of Physics D …, 2022 - iopscience.iop.org
Owing to the superior properties of the wide bandgap, high carrier mobility, high thermal
conductivity and high stability, 4H silicon carbide (4H-SiC) holds great promise for …

Mechanisms of growth and defect properties of epitaxial SiC

F La Via, M Camarda, A La Magna - Applied Physics Reviews, 2014 - pubs.aip.org
In the last ten years, large improvements in the epitaxial silicon carbide processes have
been made. The introduction of chloride precursors, the epitaxial growth on large area …

Basal plane dislocation reduction in 4H-SiC epitaxy by growth interruptions

RE Stahlbush, BL VanMil, RL Myers-Ward… - Applied Physics …, 2009 - pubs.aip.org
The paths of basal plane dislocations (BPDs) through 4 H-SiC epitaxial layers grown on
wafers with an 8 offcut were tracked using ultraviolet photoluminescence imaging. The …

Glide and multiplication of basal plane dislocations during 4H‐SiC homoepitaxy

X Zhang, M Skowronski, KX Liu, RE Stahlbush… - Journal of Applied …, 2007 - pubs.aip.org
Basal plane dislocations (BPDs) are an important category of extended defects in SiC
epilayers. They act as nucleation sites for single layer Shockley-type stacking faults which …

SiC material properties

T Kimoto - Wide bandgap semiconductor power devices, 2019 - Elsevier
This chapter introduces the crystal structure, electronic band structure, and physical
properties of silicon carbide (SiC). Physical properties are critical parameters for accurate …

Recombination-induced stacking fault degradation of 4H-SiC merged-PiN-Schottky diodes

JD Caldwell, RE Stahlbush, EA Imhoff… - Journal of Applied …, 2009 - pubs.aip.org
The increase in the forward voltage drop observed in 4 H-SiC bipolar devices due to
recombination-induced stacking fault (SF) creation and expansion has been widely …

Formation and propagation mechanism of complex stacking fault in 180 μm thick 4H-SiC epitaxial layers

NA Mahadik, RE Stahlbush, M Dudley… - Scripta Materialia, 2023 - Elsevier
The formation mechanism and propagation behavior of a complex stacking fault (SF) in thick
silicon carbide epitaxial layers was investigated using depth-resolved section X-ray …

Long range, non-destructive characterization of GaN substrates for power devices

JC Gallagher, TJ Anderson, LE Luna, AD Koehler… - Journal of Crystal …, 2019 - Elsevier
It has been well established that GaN grown on native substrates yields higher quality films
compared to those grown on non-native substrates, such as SiC or Si. However …