The ever increasing requirements for electrical performance of on-chip wiring has driven
three major technological advances in recent years. First, copper has replaced Aluminum as …

This article reviews the present state of research on metal–zirconia interfaces. Interfaces
play a crucial role in establishing the macroscopic properties and performance of zirconia …

Organic solar cells that have all-polymer active layers may have several advantages
compared with polymer–small molecule systems including improved mechanical and …

Continual scaling of on-chip wiring structures has brought significant challenges for
materials and processes beyond the 32-nm technology node in microelectronics. Recently …

The critical operation needed to achieve monolithic three-dimensional integrated circuits is
obtaining single-crystal, device-quality semiconductor material for upper layer active circuits …

A relationship between the adhesion of a Cu conductor to its surrounding medium, the
electromigration drift velocity, and lifetime in a conventional electromigration test has been …

A cohesive surface theory of fracture is a phenomenological continuum framework that is
closely related to classical fracture mechanics. As such it shares the advantages and …

Effects of Ag content on fracture resistance of Sn–Ag–Cu solders under high-strain rate
conditions are examined in an attempt to optimize bulk properties of solders for enhanced …

For the realization of flexible electronic devices, the metal–polymer interfaces upon which
they are based need to be optimized. These interfaces are prone to fracture in such systems …

My 12-year-old granddaughter Nina Alesi once asked me," Grandpa, you are a scientist at
IBM, so what do you do?" I tried to reply," Oh, I watch atoms move..." But before I could finish …