Carbon nanotubes and related nanomaterials: critical advances and challenges for synthesis toward mainstream commercial applications

R Rao, CL Pint, AE Islam, RS Weatherup, S Hofmann… - ACS …, 2018 - ACS Publications
Advances in the synthesis and scalable manufacturing of single-walled carbon nanotubes
(SWCNTs) remain critical to realizing many important commercial applications. Here we …

Recent progress and challenges regarding carbon nanotube on-chip interconnects

B Xu, R Chen, J Zhou, J Liang - Micromachines, 2022 - mdpi.com
Along with deep scaling transistors and complex electronics information exchange networks,
very-large-scale-integrated (VLSI) circuits require high performance and ultra-low power …

Soluble polysulphide sorption using carbon nanotube forest for enhancing cycle performance in a lithium–sulphur battery

K Xi, B Chen, H Li, R Xie, C Gao, C Zhang, RV Kumar… - Nano Energy, 2015 - Elsevier
The rapid capacity decay of lithium–sulphur batteries has been a significant obstacle for
practical application, which is generally considered to arise from dissolution of lithium …

[图书][B] Nanopackaging: Nanotechnologies and electronics packaging

JE Morris - 2018 - Springer
Level one electronics packaging is traditionally defined as the design and production of the
encapsulating structure that provides mechanical support, environmental protection …

Carbon-assisted catalyst pretreatment enables straightforward synthesis of high-density carbon nanotube forests

NT Dee, J Li, AO White, C Jacob, W Shi, PR Kidambi… - Carbon, 2019 - Elsevier
Despite extensive academic and commercial development, a comprehensive understanding
of the principles necessary for high-yield production of carbon nanotubes (CNTs) is lacking …

A sweet spot for highly efficient growth of vertically aligned single-walled carbon nanotube forests enabling their unique structures and properties

G Chen, RC Davis, DN Futaba, S Sakurai, K Kobashi… - Nanoscale, 2016 - pubs.rsc.org
We investigated the correlation between growth efficiency and structural parameters of
single-walled carbon nanotube (SWCNT) forests and report the existence of a SWCNT …

Vertically aligned CNT-Cu nano-composite material for stacked through-silicon-via interconnects

S Sun, W Mu, M Edwards, D Mencarelli… - …, 2016 - iopscience.iop.org
For future miniaturization of electronic systems using 3D chip stacking, new fine-pitch
materials for through-silicon-via (TSV) applications are likely required. In this paper, we …

Modeling a copper/carbon nanotube composite for applications in electronic packaging

Y Feng, SL Burkett - Computational Materials Science, 2015 - Elsevier
A model is developed to determine the current density for a copper/carbon nanotube matrix
configured as through silicon vias, an appropriate structure for interconnect applications …

A survey of carbon nanotube interconnects for energy efficient integrated circuits

A Todri-Sanial, R Ramos, H Okuno… - IEEE Circuits and …, 2017 - ieeexplore.ieee.org
This article is a review of the state-of-art carbon nanotube interconnects for Silicon
application with respect to the recent literature. Amongst all the research on carbon …

Through-silicon-via interposers with Cu-level electrical conductivity and Si-level thermal expansion based on carbon nanotube-Cu composites for microelectronic …

G Chen, R Sundaram, A Sekiguchi… - ACS Applied Nano …, 2020 - ACS Publications
Through-silicon-via (TSV) interposers using silicon and copper represent a critical element
in microelectronic packaging, as they bridge between fine-pitch inputs/outputs at the …