US11784108B2 - Thermal management in integrated circuit packages - Google Patents
US11784108B2 - Thermal management in integrated circuit packages - Google Patents …

US20210043573A1 - Thermal management in integrated circuit packages - Google Patents
US20210043573A1 - Thermal management in integrated circuit packages - Google Patents …

(57) ABSTRACT A semiconductor device includes a first chip package, a heat dissipation
structure and an adapter. The first chip package includes a semiconductor die laterally …

US11037860B2 - Multi layer thermal interface material - Google Patents US11037860B2 - Multi
layer thermal interface material - Google Patents Multi layer thermal interface material Download …

US11830787B2 - Thermal management in integrated circuit packages - Google Patents
US11830787B2 - Thermal management in integrated circuit packages - Google Patents …

A package structure and a manufacturing method are provided. The package structure
includes a wiring structure, a first electronic device, a second electronic device, a first …

2022-05-23 Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
reassignment TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD …

(57) ABSTRACT A method includes placing a package, which includes a first package
component, a second package component, and an encapsulant encapsulating the first …

Cooling devices, packaged semiconductor devices, and methods of packaging
semiconductor devices are disclosed. In some embodiments, a cooling device for a …

A method of forming a semiconductor structure includes: attaching a semiconductor device
to a first surface of a substrate; placing a thermal interface material (TIM) film over a first side …