Review on Corrosion in Electronic Packaging Trends of Collaborative between Academia–Industry
This article reviews corrosion in electronic packaging mainly in the semiconductor industry
over the world. The previous study was reviewed scientifically to highlight the significant …
over the world. The previous study was reviewed scientifically to highlight the significant …
Effect of CoSn3 nanocrystals on Sn3Ag plating for electronic packaging
J Wang, L Zhang, ZW Lv, J Wang, W Zhang, X Wang… - Scientific Reports, 2023 - nature.com
Abstract Plating Sn3Ag on copper substrates represents a crucial electronic packaging
technique. In this study, we propose a novel composite plating approach, wherein CoSn 3 …
technique. In this study, we propose a novel composite plating approach, wherein CoSn 3 …
In situ study of electrochemical migration of Sn3Ag0.5Cu solder reinforced by Cu6Sn5 nanoparticles
Z Lv, J Wang, F Wang, W Zhang, J Wang, F Li… - Journal of Materials …, 2023 - Springer
The increasing packaging density and power density have led to a drastic increase in the
electric field strength between solder joints, and the accelerated movement of ions …
electric field strength between solder joints, and the accelerated movement of ions …