An overview of non-destructive testing methods for integrated circuit packaging inspection
The article provides a review of the state-of-art non-destructive testing (NDT) methods used
for evaluation of integrated circuit (IC) packaging. The review identifies various types of the …
for evaluation of integrated circuit (IC) packaging. The review identifies various types of the …
Laser‐ultrasonics: from the laboratory to industry
JP Monchalin - AIP Conference Proceedings, 2004 - pubs.aip.org
A broad overview of the field of laser‐ultrasonics is presented. This overview draws from
developments at the Industrial Materials Institute of the National Research Council of …
developments at the Industrial Materials Institute of the National Research Council of …
Laser-ultrasonics: principles and industrial applications
JP Monchalin - … and advanced methods for nondestructive testing …, 2007 - World Scientific
A broad overview of the field of laser-ultrasonics is presented. This overview draws from
developments at the Industrial Materials Institute of the National Research Council of …
developments at the Industrial Materials Institute of the National Research Council of …
Understanding, Modeling and Predicting Hidden Solder Joint Shape Using Active Thermography
J Giron Palomares - 2012 - oaktrust.library.tamu.edu
Characterizing hidden solder joint shapes is essential for electronics reliability. Active
thermography is a methodology to identify hidden defects inside an object by means of …
thermography is a methodology to identify hidden defects inside an object by means of …
[PDF][PDF] Understanding, modeling and predicting hidden solder joint shape using active thermography
JG Palomares - 2012 - core.ac.uk
Characterizing hidden solder joint shapes is essential for electronics reliability. Active
thermography is a methodology to identify hidden defects inside an object by means of …
thermography is a methodology to identify hidden defects inside an object by means of …
Electronic hidden solder joint geometry characterization
SJ Hsieh - Thermosense XXXI, 2009 - spiedigitallibrary.org
To reduce the size of electronic equipment, multi-layer printed circuit board structures have
become popular in recent years. As a result, the inspection of hidden solder joints between …
become popular in recent years. As a result, the inspection of hidden solder joints between …